Array Substrate Grid Conductive Structure UV Curing
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Solution Overview
Problem
In LCD panel production, the large planar conductive portions in array substrates block ultraviolet light, leading to incomplete curing of adhesives and issues like liquid crystal leakage and moisture infiltration due to weakened UV intensity.
Innovation Solution
The array substrate design includes conductive structures with connection portions and vias that allow for improved light transmittance by providing openings, ensuring that the orthographic projection of these openings does not overlap with the via projections, thereby enhancing UV curing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If large planar conductive portions are used in the array substrate, then electrical connection is improved, but ultraviolet light transmission is blocked
Solution Approach 1:
The conductive portions are segmented into grid patterns with conductive lines arranged in rows and columns, creating multiple small conductive segments instead of large continuous planar portions. This segmentation maintains electrical connectivity through the grid structure while reducing UV light blocking area, allowing sufficient UV transmission for adhesive curing.
Solution Approach 2:
The conductive structure transitions from uniform large-area coverage to localized grid patterns with specific line widths and spacing. The local quality is optimized by adjusting the grid density and line dimensions to balance electrical conductivity requirements with UV light transmission needs in different regions of the substrate.
2Reliability
If large planar conductive portions are used, then electrical conductivity is improved, but adhesive curing completeness deteriorates
Solution Approach 1:
The conductive portions are divided into grid patterns that segment the substrate surface, reducing the total area blocking UV light while maintaining electrical conductivity through the interconnected grid. This enables complete adhesive curing by allowing sufficient UV penetration.
Solution Approach 2:
The physical parameters of the conductive structure are changed from large continuous areas to grid patterns with specific line widths, spacing, and density. By optimizing these parameters, the structure maintains electrical conductivity while reducing UV absorption and scattering, ensuring complete adhesive curing.
3Device complexity
If conventional conductive structures are used, then electrical connection is simplified, but light transmittance and UV curing efficiency are reduced
Solution Approach 1:
The conductive structure is segmented into grid patterns that can be implemented using standard photolithography and etching processes. While the pattern is more complex than simple planar layers, the manufacturing process remains relatively simple, and the UV curing efficiency is significantly improved due to reduced light blocking.
Solution Approach 2:
The grid pattern conductive structure serves multiple functions: it provides electrical conductivity, allows UV light transmission for adhesive curing, and can be integrated with existing thin-film transistor fabrication processes. This multi-functionality improves UV curing efficiency without requiring completely new manufacturing equipment or processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design prevents light blocking, improves backlight brightness, and ensures complete curing of ultraviolet adhesives, preventing liquid crystal leakage and moisture infiltration in LCD panels.
Implementation Method 1
the first connection portion is electrically coupled to the second connection portion through at least one via penetrating through the interlayer insulation layer
Implementation Method 2
an orthographic projection of the opening on the substrate does not overlap an orthographic projection of the via on the substrate... improves backlight brightness, and ensures complete curing of ultraviolet adhesives
Implementation Method 3
the intensity of the ultraviolet light is weakened, and an ultraviolet curing adhesive irradiated by the ultraviolet light with weakened intensity is not completely cured... ensures complete curing of ultraviolet adhesives, preventing liquid crystal leakage and moisture infiltration
Data Source
AI summary
The present disclosure provides an array substrate, a display panel, and a display device. The array substrate includes: a substrate; and a first conductive structure, an interlayer insulation layer, and a second conductive structure sequentially disposed on the substrate. The first conductive structure has a first connection portion, the second conductive structure has a second connection portion, and the first connection portion is electrically coupled to the second connection portion through a via penetrating through the interlayer insulation layer. At least one of the first connection portion and the second connection portion is provided with an opening, and an orthographic projection of the opening on the substrate does not overlap an orthographic projection of the via on the substrate.