Array Substrate Groove for Micro LED Adhesive Bonding
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Solution Overview
Problem
The process of preparing micro LED display panels is complicated due to the need for welding micro LEDs onto array substrates, which requires intricate alignment and processing steps.
Innovation Solution
An array substrate with a planarization pattern featuring a via and a groove is used, where a conductive structure connects a bonding pattern to a thin film transistor, allowing a micro LED to be fixedly connected to the substrate using an adhesive in the groove, eliminating the need for welding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If welding process is used to connect micro LEDs to array substrate, then electrical connection is achieved, but process complexity and alignment difficulty increase
Solution Approach 1:
The patent replaces the welding process (thermal/mechanical system) with a mechanical bonding process using adhesive. The bonding pattern with groove structure allows adhesive to mechanically bond the micro LED to the array substrate without requiring welding, thereby eliminating the complexity of welding equipment and alignment procedures while maintaining reliable electrical connection through the conductive adhesive or conductive structure.
Solution Approach 2:
The bonding pattern with groove structure serves as an intermediary element between the micro LED and the array substrate. The groove accommodates adhesive that acts as a mediator to achieve both mechanical bonding and electrical connection, eliminating the need for direct welding between the micro LED and substrate while ensuring reliable electrical connection.
2Reliability
If welding process is used to connect micro LEDs to array substrate, then electrical connection is achieved, but alignment precision requirements increase
Solution Approach 1:
The bonding pattern is segmented into multiple functional regions including the groove structure for adhesive accommodation, positioning protrusions or features for alignment, and conductive regions for electrical connection. This segmentation allows each function to be optimized independently, with the groove providing adhesive containment for robust bonding and reduced alignment sensitivity.
Solution Approach 2:
The patent changes the bonding mechanism parameter from thermal welding to adhesive bonding. The groove structure in the bonding pattern is designed with specific dimensions and geometry to optimize adhesive distribution and bonding strength. This parameter change allows for greater tolerance in alignment while maintaining reliable electrical connection through the conductive adhesive path.
3Reliability
If welding process is used to connect micro LEDs to array substrate, then electrical connection is achieved, but manufacturing time and cost increase
Solution Approach 1:
The bonding pattern with groove structure is pre-formed on the array substrate before micro LED attachment. The groove is designed to automatically guide and contain the adhesive, eliminating the need for precise real-time alignment during the bonding process. This preliminary action simplifies the manufacturing process and increases productivity by reducing the time required for alignment and bonding operations.
Solution Approach 2:
The patent employs adhesive bonding instead of welding, using consumable adhesive material that is inexpensive compared to welding equipment and processes. The bonding pattern with groove structure is designed to use minimal adhesive while achieving robust bonding, reducing material cost and simplifying the manufacturing process for higher productivity.
Data Source
AI summary
Disclosed are an array substrate, and a display device, and a method for manufacturing the same. The array substrate includes: a base substrate, and a thin film transistor, a planarization pattern, a bonding pattern, and a conductive structure that are disposed on the base substrate. The thin film transistor, the planarization pattern, and the bonding pattern are laminated in a direction going distally from the base substrate. The planarization pattern is provided with a via and a groove, the conductive structure is disposed in the via, wherein the bonding pattern is conductive and is electrically connected to the thin film transistor by the conductive structure, an orthographic projection of the bonding pattern on the base substrate falls outside an orthographic projection of the groove on the base substrate, and the groove is configured to accommodate an adhesive.