Array Substrate Groove Bonding to Prevent OLB Adhesive Overflow
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Solution Overview
Problem
In display technology, the bonding process in the Outer Lead Bonding (OLB) region of array substrates leads to water-vapor corrosion due to adhesive overflow, resulting in poor reliability and bubble formation in the sealant, which affects the quality of the array substrate.
Innovation Solution
The array substrate design includes a groove with a conductive adhesive extending to the edge of the groove adjacent to the display region, preventing adhesive overflow and ensuring smooth sealant flow, thereby preventing corrosion and improving substrate quality. This design involves a substrate with a metal layer, intermediate layer, conductive film, and conductive adhesive, where the conductive adhesive is disposed on one side of the conductive film in the groove, extending to the edge of the groove, and an optical adhesive is used for additional protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding is carried out in the groove in the OLB region, then bonding requirements are met, but water-vapor corrosion occurs and reliability deteriorates
Solution Approach 1:
The patent introduces a conductive adhesive as an intermediary substance between the metal layer and the groove wall. This conductive adhesive serves multiple functions: it provides bonding capability, prevents water-vapor corrosion by sealing the interface, and maintains electrical conductivity. The intermediary layer eliminates direct contact between corrosive environments and metal terminals while satisfying bonding requirements.
Solution Approach 2:
The conductive adhesive is applied in advance to the groove bottom and walls before the bonding process. This preliminary action ensures that the bonding interface is already protected against water-vapor corrosion before bonding occurs, preventing corrosion from the outset rather than attempting to address it after bonding.
2Ease of manufacture
If adhesive is used for bonding in the groove, then bonding is achieved, but adhesive overflow occurs causing bubbles in sealant and quality deterioration
Solution Approach 1:
The patent changes the parameters of the adhesive by using a conductive adhesive with specific viscosity and spreading characteristics. This conductive adhesive is formulated to have controlled flow properties that prevent overflow into the sealant region while still providing adequate bonding. The parameter change in adhesive type and properties eliminates the overflow problem that causes bubbles in the sealant.
Solution Approach 2:
The conductive adhesive is applied locally and precisely within the groove region, with its spread controlled to extend only to the edge of the groove adjacent to the display region. This local quality control ensures that the adhesive remains confined to where it is needed for bonding, preventing it from overflowing into the sealant area and creating bubbles.
Data Source
AI summary
An array substrate, a display panel, and a display device are provided. The array substrate has a display region and a non-display region, and the array substrate includes a substrate, a metal layer, an intermediate layer, a conductive film, and a conductive adhesive disposed in the non-display region. The metal layer is disposed on one side of the substrate, and the intermediate layer is disposed on one side of the metal layer away from the substrate. The array substrate defines a groove penetrating through the intermediate layer. The conductive film is disposed on one side of the intermediate layer away from the substrate and extends into the groove, and the conductive adhesive is disposed on one side of part of the conductive film in the groove away from the substrate, and at least extends to an edge of the groove adjacent to the display region.