Array Substrate Groove Filler for High-Resolution Display Panels
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Solution Overview
Problem
High-resolution TFT-LCD display panels face the challenge of skew defects due to densely arranged data lines in the fanout area, leading to uneven photoresist layers and size discrepancies in conductive layers, which result in display panel defects during assembly.
Innovation Solution
The array substrate features leading wires forming grooves in the fanout area, which are filled with an insulating and transparent filler, ensuring the filler's surface is flush with the surrounding wires, and the filler is made from materials like silicon nitride, silicon oxide, or semiconductor oxides, preventing electrical cross-talk and facilitating UV glue curing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If data lines are arranged more densely in the fanout area to accommodate higher resolution, then the number of signal lines increases, but grooves occur and cause skew defects
Solution Approach 1:
The patent applies preliminary action by filling the grooves with insulating material before the photoresist coating process. This pre-filling eliminates the uneven surface that would otherwise cause non-uniform photoresist thickness, thereby preventing skew defects while allowing dense data line arrangement for high resolution.
Solution Approach 2:
The patent introduces an intermediary substance (insulating material such as silicon oxide or silicon nitride) to fill the grooves formed by densely arranged data lines. This intermediary material acts as a mediator between the uneven groove structure and the photoresist layer, ensuring uniform photoresist coating without affecting the underlying signal line density.
2Object-affected harmful factors
If data lines are arranged alternately in different layers to reduce grooves, then layer complexity increases, but manufacturing complexity increases
Solution Approach 1:
The patent extracts the problematic grooves from the surface by filling them with insulating material, separating the groove-filling function from the signal line arrangement. This allows data lines to remain in a simpler single-layer or alternative configuration without causing skew defects, thereby reducing overall manufacturing complexity compared to multi-layer alternating arrangements.
3Manufacturing precision
If grooves are filled with insulating material, then skew defect is reduced, but additional manufacturing steps are required
Solution Approach 1:
The patent merges the groove filling operation with existing manufacturing processes by using insulating materials that can be deposited using standard PECVD or sputtering equipment already present in the fabrication line. The filling process is integrated into the existing process flow, combining multiple functions into unified process steps and minimizing additional manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution alleviates the skew defect and uneven morphology issues, ensuring accurate assembly and preventing signal cross-talk, while allowing for effective curing of UV glues, thereby enhancing the display panel's performance and reliability.
Implementation Method 1
the filler is made from an insulating and transparent material... allowing for effective curing of UV glues
Data Source
AI summary
An array substrate, a method for fabricating the same, a display panel and a display device are disclosed. The array substrate comprises leading wires, the plurality of leading wires form a plurality of grooves in a fanout area of the array substrate, the plurality of grooves are filled with a filler, and the filler filled in the grooves has an upper surface which is flush with leading wires surrounding the grooves. The filler is made from an insulating and transparent material.