Array Substrate Groove Structure for Narrow Frame Displays
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Solution Overview
Problem
Existing narrow-frame display products face challenges in reducing the frame width without compromising the packaging function, particularly in the integration of driving circuits and packaging areas, which limits the reduction of the peripheral area and affects the display quality and splicing seam width in splicing screens.
Innovation Solution
The array substrate incorporates a packaging metal layer with groove structures in the package area to accommodate capacitive structures, allowing for a concave-convex configuration that reduces the frame width by integrating the driving circuit area closer to the package area without affecting the packaging effect, thus enabling a larger active area to peripheral area ratio.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the frame width is reduced to achieve a narrow-frame display product, then the active area to peripheral area ratio is improved, but the packaging function is compromised
Solution Approach 1:
The invention moves the driving circuit from a planar arrangement to a three-dimensional groove structure within the packaging metal layer. This vertical integration allows the driving circuit to occupy space in the Z-dimension rather than only the X-Y plane, enabling frame width reduction without compromising packaging functionality.
Solution Approach 2:
The driving circuit is nested within the packaging metal layer by forming grooves that accommodate the driving circuit elements. This nesting approach allows the driving circuit to be embedded within the packaging structure, effectively utilizing the packaging area for dual purposes: packaging and driving circuit integration.
2Area of stationary object
If the driving circuit area is integrated closer to the package area to reduce peripheral area, then the frame width is reduced, but the packaging effect is affected
Solution Approach 1:
The invention merges the driving circuit area and packaging area by integrating the driving circuit within the packaging metal layer. The grooves are formed in the packaging metal layer, and the driving circuit is arranged within these grooves, effectively combining both functional areas into a unified structure that reduces peripheral area while maintaining packaging effectiveness.
3Area of stationary object
If the groove structure is formed in the packaging metal layer to accommodate driving circuits, then the frame width is reduced, but the manufacturing complexity increases
Solution Approach 1:
The packaging metal layer is segmented by forming grooves that divide the layer into distinct regions for accommodating driving circuit elements. This segmentation is achieved through standard photolithography and etching processes, breaking down the complex task of integration into manageable manufacturing steps that can be performed using existing fabrication techniques.
Data Source
AI summary
An array substrate, a display panel and a display device are provided. The array substrate comprises: an active area, a package area and a drive circuit area, wherein the drive circuit area is located between the active area and the package area. A package metal layer is provided at the package area, and at least one groove structure is provided on a side of the package metal layer in a proximity to the drive circuit area. At least one drive unit is provided at the drive circuit area and comprises at least one element, wherein the element is provided in the groove structure.