Array Substrate Groove Taper Angle for Photoresist Removal
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Solution Overview
Problem
The accumulation of photoresist at the bottom of grooves in the organic planarization layer during the manufacturing of low temperature polysilicon display panels leads to residual indium tin oxide, causing electrostatic discharge and potential injury due to incomplete removal during the etching process.
Innovation Solution
The manufacturing method involves creating a groove with side inclined planes at an included angle of 30° to 45°, formed by connecting multiple sub-planes at equal intervals, which reduces the thickness of photoresist at the groove bottom and facilitates effective removal, preventing residual photoresist and metal residue.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the organic planarization layer is made thicker (2-3 um) to meet design requirements, then the planarization effect is improved, but photoresist accumulates in the groove causing incomplete removal and metal residue
Solution Approach 1:
The patent changes the geometric parameters of the groove by reducing the tilt angle from the conventional 45-60 degrees to 30-45 degrees. This parameter modification allows the photoresist layer to be thinner at the groove bottom while maintaining adequate thickness at the opening, enabling complete photoresist removal without metal residue while preserving the planarization function of the thicker organic planarization layer
2Object-generated harmful factors
If the tilt angle of the groove is reduced to 30-45 degrees, then photoresist accumulation is reduced and removal is improved, but the groove structure becomes more complex to manufacture
Solution Approach 1:
The patent modifies the tilt angle parameter within a specific range (30-45 degrees) that balances manufacturing feasibility with photoresist removal effectiveness. This optimized parameter range ensures that the groove can still be manufactured using conventional processes while achieving the dual benefit of reduced photoresist accumulation and complete removal capability
3Productivity
If photoresist thickness in the groove is reduced, then complete removal during development is achieved, but the protective function during etching is compromised
Solution Approach 1:
The reduced tilt angle creates a gradual thickness gradient in the photoresist layer, where the thickness varies continuously from the groove bottom to the opening. This gradient structure ensures that even with reduced overall thickness, the photoresist maintains adequate protective function at critical locations while enabling complete removal from the groove bottom
Solution Approach 2:
The patent transitions from a uniform photoresist thickness approach to a spatially varying thickness distribution controlled by the groove geometry. By utilizing the vertical dimension of the groove structure, the photoresist thickness is optimized at different horizontal positions, simultaneously achieving protection where needed and removability where critical
Data Source
AI summary
The present disclosure provides an array substrate, a display panel, and a manufacturing method of the array substrate. The display panel includes the array substrate. The array substrate includes a planarization layer provided with a groove surrounding a display area in a non-display area, the groove includes a bottom surface and two side inclined planes, and an included angle (taper angle) between the bottom surface and the side inclined planes ranges from 30° to 45°. When manufacturing the groove, a plurality of side inclined sub-planes are manufactured at intervals and connected to each other to form the side inclined planes.