Array Substrate Grooves for Uniform Conductive Particle Sealing
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Solution Overview
Problem
Conductive terminals in liquid crystal display panels often experience short circuits due to uneven distribution of conductive particles during the crimping process, leading to gaps without conductive particles between metal wires and contacts.
Innovation Solution
The array substrate design includes grooves with inclined surfaces and conductive terminals with specific cross-sectional shapes, ensuring uniform sealing of conductive particles between the first and second terminals, increasing the contact area and stability of the crimping gap, thereby preventing short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional protrusion contacts are used for crimping metal wires, then the terminal structure is simple, but conductive particles gather in gaps causing short circuits between adjacent terminals
Solution Approach 1:
The terminal structure is segmented into multiple components: a first terminal embedded in the substrate, a crimping terminal with crimping layer and second terminal, and grooves dividing the peripheral region. This segmentation isolates conductive particles within specific gaps, preventing them from migrating to adjacent terminals and causing short circuits.
Solution Approach 2:
The crimping layer acts as an intermediary component between the first terminal and the second terminal. It creates a controlled gap structure that confines conductive particles, ensuring stable conduction while preventing particle migration to adjacent terminals. The grooves also serve as intermediary structures to isolate different terminal gaps.
2Reliability
If conductive particles are used for crimping connections, then electrical conduction is achieved, but particles flow during crimping causing uneven distribution and short circuits
Solution Approach 1:
The groove structure creates local quality differences by confining conductive particles within specific spatial boundaries. Each groove defines a localized region where particles are uniformly distributed, preventing them from flowing into adjacent terminal gaps. This local confinement ensures consistent particle distribution across all terminals.
Solution Approach 2:
The grooves are pre-formed in the substrate before the crimping process. This preliminary action establishes the particle confinement structure in advance, ensuring that when conductive particles are applied and crimping occurs, the particles are already positioned within the correct boundaries and cannot migrate to cause short circuits.
3Reliability
If metal wires are crimped with protrusion contacts, then terminal connection is formed, but gaps without conductive particles are created leading to poor conduction
Solution Approach 1:
The crimping layer serves as an intermediary that creates a controlled gap structure between the first terminal and second terminal. This gap is designed to accommodate conductive particles, ensuring they are positioned accurately during the crimping process. The groove boundaries further mediate particle placement, preventing migration and ensuring consistent conduction.
Solution Approach 2:
The invention changes the geometric parameters of the terminal structure by introducing grooves with specific dimensions and shapes. These parameter changes create optimal gap sizes for particle accommodation, ensuring that conductive particles are uniformly distributed and maintain stable electrical conduction without migrating to adjacent terminals.
Data Source
AI summary
The present invention provides an array substrate, which comprises a peripheral region and a plurality of conductive terminals disposed in the peripheral region. The peripheral region comprises a base substrate and a buffer layer, an insulating layer, and an interlayer dielectric layer orderly-overlapping disposed on the substrate. The array substrate further comprises grooves extending from the interlayer dielectric layer to the base substrate. Each of the conductive terminals comprises a first terminal, a crimping terminal which comprises a crimping layer and a second terminal disposed on the crimping layer, and a plurality of conductive particles. The first terminal comprises a connection section and an extension section, which is connected with the connection section. The second terminal is inserted into the groove. The conductive particles are uniformly sealed in a gap, so as to achieve the conduction between the first terminal and the second terminal.