Array Substrate Test Lead Layout to Prevent Adapter Hole Oxidation
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Solution Overview
Problem
Existing display technologies face issues with abnormal screen displays due to resistance increases at adapter holes, caused by electrochemical oxidation of metal layers during the manufacturing process, leading to insufficient charging rates of pixels and reduced product yield.
Innovation Solution
The proposed solution involves an array substrate design that includes a base substrate with data signal lines, fan-out lines, and a test lead wire structure. The test lead wire is segmented into layers to avoid direct electrical connection, preventing static electricity from moving to fan-out lines and reducing the formation of metal oxide layers at adapter holes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the test lead wire is arranged in the same layer as fan-out lines and directly connected, then the manufacturing process is simplified, but electrochemical oxidation occurs at adapter holes causing resistance increase
Solution Approach 1:
The test lead wire is divided into two separate segments: a first lead wire segment in the gate material layer and a second lead wire segment in the source-drain material layer. These segments are not directly connected but are both lapped with fan-out lines through adapter holes, preventing electrochemical oxidation while maintaining manufacturing feasibility
Solution Approach 2:
The fan-out lines serve as an intermediary conductor between the first and second lead wire segments. Instead of directly connecting the two segments (which would cause oxidation), both segments connect to the fan-out lines through separate adapter holes, using the fan-out lines as a mediating pathway for electrical connection
2Ease of operation
If static electricity is allowed to move freely to fan-out lines, then test pad discharge is achieved, but metal oxide layers form at adapter holes increasing resistance
Solution Approach 1:
By segmenting the test lead wire into two non-directly-connected parts in different material layers, the patent allows static electricity to be discharged through the fan-out lines while preventing the electrochemical oxidation reaction that would otherwise occur at a direct connection point between lead wire segments
Solution Approach 2:
The patent converts the potentially harmful effect of static electricity discharge into a beneficial testing function. By routing static discharge through the fan-out lines via adapter holes rather than creating a direct lead wire connection, the harmful oxidation is prevented while still achieving the desired static electricity discharge for testing purposes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively eliminates resistance increases at adapter holes, preventing abnormal displays and improving product yield by ensuring consistent charging rates across pixels.
Implementation Method 1
the first lead wire segment is lapped with the second lead wire segment at the adapter hole
Implementation Method 2
resistance increases at adapter holes, caused by electrochemical oxidation of metal layers during the manufacturing process
Data Source
AI summary
An array substrate, a display panel, a display device, and a method for manufacturing an array substrate are provided. The array substrate includes an array substrate; a plurality of data signal lines arranged on the base substrate; a plurality of fan-out lines arranged side-by-side on the base substrate and respectively lapped with the plurality of data signal lines through adapter holes; and a first test lead wire arranged on the base substrate, wherein the first test lead wire includes a first test pad, a first lead wire segment, and a second lead wire segment, the first lead wire segment is electrically connected to at least a part of the plurality of fan-out lines and arranged in a same layer as the fan-out lines, and the second lead wire segment is electrically connected to the first test pad and lapped with the first lead wire segment through an adapter hole.