Array Substrate Interlaced Connection Terminals Bonding Yield
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Solution Overview
Problem
The spacing between connection terminals on array substrates is excessively small, leading to short circuiting and poor bonding during the bonding process, especially in high-resolution display devices where precision is high.
Innovation Solution
The design of the array substrate includes signal conversion lines that extend in a first direction to connect adjacent connection terminals, with projections of the connection terminals arranged such that they do not overlap on a reference plane perpendicular to the terminal disposition, creating an interlaced pattern that increases the spacing between terminals and improves bonding yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the connection terminals and signal conversion lines are densely arranged to achieve high resolution, then the product resolution is improved, but the spacing between connection terminals becomes excessively small causing short circuiting and poor bonding
Solution Approach 1:
The patent divides the bonding area into multiple sub-areas arranged in the first direction, with connection terminals distributed across these sub-areas. By introducing the dimension of sub-area segmentation along the first direction, the patent achieves dense terminal arrangement in the second direction (for high resolution) while maintaining adequate spacing through the spatial separation provided by the sub-area structure. This dimensional approach allows simultaneous achievement of high terminal density and sufficient bonding spacing.
Solution Approach 2:
The bonding area is segmented into multiple sub-areas, and connection terminals are segmented across these sub-areas. This segmentation allows the patent to distribute terminals in a structured manner that prevents short circuiting while achieving high overall density. The segmentation of the bonding area into manageable sub-areas enables precise control of terminal spacing and positioning.
2Reliability
If the spacing between connection terminals is increased to prevent short circuiting, then the bonding reliability is improved, but the terminal density decreases affecting product resolution
Solution Approach 1:
The patent resolves this contradiction by utilizing multiple directions (first direction for sub-area arrangement, second direction for terminal arrangement within sub-areas). This multi-dimensional approach allows increased spacing in critical bonding directions while maintaining high terminal density through efficient packing in other directions, thereby achieving both reliable bonding and high resolution.
Solution Approach 2:
Different regions (sub-areas) of the bonding area have different local characteristics in terms of terminal density and spacing. The patent optimizes the local arrangement of connection terminals in each sub-area to achieve appropriate spacing for reliable bonding while maintaining overall high density through strategic local variations in terminal distribution patterns.
Data Source
AI summary
An array substrate and a display panel are proposed. Each of the signal conversion lines of the array substrate extends in the first direction, and connects two connection terminals adjacent to the each of signal conversion lines. Projections of the connection terminals on the reference plane in the second direction do not overlap. In this manner, the design that the adjacent connection terminals are interlaced can increase the spacing between the adjacent connection terminals, thus resolving the problem that the spacing between connection terminals on the array substrate is excessively small and short circuiting tends to happen when bonding to cause poor bonding in the related art.