Array Substrate Jumper Wiring via Via Holes
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Solution Overview
Problem
Existing array substrates for liquid crystal displays face high impedance issues at jumper joints due to the use of materials like indium tin oxide and indium zinc oxide, which hinder signal transmission and increase power consumption.
Innovation Solution
The array substrate design includes via holes in the first insulating layer allowing direct contact between the jumper in the second metal layer and the first and second wirings, eliminating the need for transparent electrodes and reducing contact impedance, with a manufacturing method that patterns metal layers and insulating layers to achieve this configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If transparent electrodes (ITO or IZO) are used to connect the jumper with the first and second wirings, then the array substrate can be manufactured with a complete insulating structure, but the contact impedance becomes high which is not conducive to signal transmission and increases power consumption
Solution Approach 1:
The patent extracts and removes the transparent electrode layer from the connection structure between the jumper and wirings. By eliminating this high-impedance component, the connection achieves low impedance through direct metal-to-metal contact via via holes, while the insulating function is maintained through the surrounding insulating layer structure.
Solution Approach 2:
The patent changes the electrical conductivity parameter of the connection path by transitioning from transparent electrode material (high resistivity) to metal material (low resistivity). This parameter change dramatically reduces contact impedance while maintaining the insulating structure's functional integrity through alternative design arrangements.
2Reliability
If transparent electrodes are used for connecting the jumper, then the insulating structure can be maintained, but the power consumption increases due to high contact impedance
Solution Approach 1:
The patent removes the transparent electrode layer from the connection path, eliminating the high-impedance element that causes excessive power consumption. The insulating structure is preserved through the surrounding insulating layer while the connection achieves low impedance via direct metal contact.
Solution Approach 2:
The patent changes the electrical conductivity parameter by replacing transparent electrode material with metal material in the connection path. This reduces resistance and consequently decreases power consumption according to the relationship P=I²R, while the insulating function is maintained through alternative structural arrangements.
3Ease of manufacture
If via holes penetrating multiple insulating layers are formed to connect wirings, then the wiring connections can be achieved, but the manufacturing complexity and the risk of Electro-Static Discharge increase
Solution Approach 1:
The patent extracts and eliminates one insulating layer from the via hole path. By removing the second insulating layer requirement, the via holes only need to penetrate the first insulating layer, simplifying the manufacturing process and reducing ESD risk while maintaining effective wiring connections.
Solution Approach 2:
The patent discards the second insulating layer in the context of via hole formation for jumper connections. This selective removal reduces manufacturing complexity and ESD risk, while the first insulating layer remains to provide necessary insulation where required, achieving a balanced simplification.
Data Source
AI summary
The present disclosure discloses an array substrate, manufacturing method thereof, and display device. The array substrate comprises: a first wiring and a second wiring located in a first metal layer; a first insulating layer covering the first metal layer, wherein the first insulating layer is provided with via holes corresponding to the first wiring and the second wiring respectively; and a jumper located in a second metal layer provided on the first insulating layer, wherein the jumper is connected with the first wiring and the second wiring through the via holes, thereby the first wiring and the second wiring being electrically conducted with each other through the jumper. The array substrate of the present disclosure can be used in liquid crystal television, liquid crystal display, mobile phone, tablet personal computer and other display devices.