Array Substrate Lap-Joint Wiring for Foldable Display Bending Areas
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Solution Overview
Problem
Conventional display technologies require multiple layers of connection lines in bending areas, leading to high electrical resistance and poor contact, which hampers efficient signal transmission.
Innovation Solution
An array substrate design featuring a recessed inorganic stacked layer with a single layer of metal lines forming a lap joint in the bending area, reducing the number of connection lines needed and improving contact efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple layers of connection lines are used in the bending area, then electrical connection between two sides of the bending area is achieved, but electrical resistance increases and contact quality deteriorates
Solution Approach 1:
The patent transitions from a planar multi-layer connection structure to a three-dimensional folded structure. The connection line is folded back within the bending area, creating overlapping segments that establish electrical contact through vertical stacking rather than horizontal layering. This dimensional change allows multiple connection points to be achieved within a single layer, reducing overall structure complexity while maintaining reliable electrical connection.
Solution Approach 2:
The connection line is folded back and nested within itself in the bending area, creating overlapping segments that are positioned vertically one above the other. This nesting approach allows the connection line to utilize its own structure as the contact interface, eliminating the need for separate contact layers and reducing the total number of layers required while ensuring reliable electrical connection through the nested overlapping segments.
2Reliability
If multiple layers of connection lines are disposed in the bending area, then electrical connection is realized, but manufacturing complexity increases
Solution Approach 1:
The patent merges the functions of connection line transmission and electrical contact into a single integrated structure. The folded connection line simultaneously serves as both the signal transmission path and the contact interface, eliminating the need for separate contact layers. This merging of functions simplifies the manufacturing process by reducing the number of deposition and patterning steps required while ensuring reliable electrical connection through the folded overlapping segments.
Solution Approach 2:
The solution moves from a two-dimensional planar multi-layer structure to a three-dimensional folded structure within the same layer. This dimensional transformation allows the connection line to create multiple contact points by folding back and overlapping with itself, thereby achieving reliable electrical connection without the need for multiple deposited layers, thus simplifying the manufacturing process.
3Reliability
If a double-layer source/drain metal layer connection structure is used in the bending area, then connection is achieved, but electrical resistance of signal lines increases
Solution Approach 1:
The patent replaces the planar double-layer source/drain structure with a three-dimensional folded connection line structure. The connection line folds back within the bending area, creating overlapping segments that establish vertical electrical contact. This dimensional change allows the connection to be achieved within a single layer, reducing the number of layers from two to one while maintaining connection quality and reducing electrical resistance through the direct overlapping contact path.
Solution Approach 2:
The connection line is folded and nested within itself, creating overlapping segments that function as the contact interface. This nested structure allows the connection line to utilize its own body as the contact medium, eliminating the need for a second separate source/drain layer. The nested overlapping segments provide reliable electrical connection while reducing the overall layer count and electrical resistance compared to the conventional double-layer structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces electrical resistance and enhances signal connection quality by eliminating the need for multiple layers of connection lines, thereby improving the performance of display panels.
Implementation Method 1
an inorganic stacked layer disposed on the substrate layer, wherein the inorganic stacked layer is provided with a recess in the bending area
Implementation Method 2
a filling layer filled in the recess
Implementation Method 3
a second metal line disposed on the inorganic stacked layer and the filling layer, wherein the first metal lines and the second metal line form a lap joint at two sides of the bending area
Implementation Method 4
indium gallium zinc oxides (IGZOs) are deposited on the LTPS TFTs by magnetron sputtering to form the OS TFTs
Data Source
AI summary
An array substrate, a manufacturing method thereof, and a display panel are provided. The array substrate includes a bending area and a non-bending area, and further includes an inorganic stacked layer disposed on a substrate layer. A recess is formed on the inorganic stacked layer in the bending area. A plurality of first metal lines are disposed in the inorganic stacked layer at two sides of the bending area. A filling layer is filled in the recess. The array substrate further includes a second metal line disposed on the inorganic stacked layer and the filling layer, and the first metal lines at the two sides of the bending area form a lap joint by the second metal line.