Array Substrate Signal Lead Layout for Debris-Resistant Laser Cutting
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Solution Overview
Problem
During the laser cutting process in the manufacturing of display panels, metal debris can accumulate and cause short circuits between adjacent signal leads, leading to abnormal panel displays and reduced yield.
Innovation Solution
The array substrate design includes a peripheral circuit with a test area, a bonding area, and a cutting area, where the cutting openings on signal leads are positioned differently in height, increasing the distance between adjacent signal leads and reducing the likelihood of metal debris connection, thereby preventing short circuits. This design involves forming cutting openings on signal leads in the cutting area using a laser, with positions of at least one signal lead's cutting opening differing from others in height along the signal leads' extending direction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If laser cutting is performed on signal leads to disconnect test area, then test area can be separated from bonding area, but metal debris accumulates at fracture position causing short circuit between adjacent signal leads
Solution Approach 1:
The patent introduces a height dimension difference between cutting openings of adjacent signal leads. By making cutting openings at different heights along the extending direction of signal leads, the patent creates spatial separation in the vertical dimension, preventing metal debris from causing short circuits between adjacent leads while maintaining electrical connectivity requirements.
2Ease of manufacture
If cutting openings are positioned at the same height for all signal leads, then manufacturing process is simplified, but metal debris can easily connect adjacent signal leads causing short circuits
Solution Approach 1:
The patent employs asymmetric positioning of cutting openings where adjacent signal leads have cutting openings at different heights. This asymmetric arrangement breaks the symmetry that would otherwise allow metal debris to bridge adjacent leads, thereby preventing short circuits while maintaining a relatively simple manufacturing process.
3Reliability
If staggered cutting openings are implemented at different heights, then short circuit risk is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent segments the cutting process into different height levels for adjacent signal leads. By dividing the cutting positions into multiple levels (different heights), the patent reduces the risk of short circuits from metal debris while managing complexity through systematic segmentation of the cutting configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the possibility of short circuits between adjacent signal leads due to metal debris, thereby improving the yield and reliability of display panels by ensuring that the cutting openings are staggered in height, preventing metal debris from connecting the leads.
Implementation Method 1
cutting the signal leads in the cutting area by a laser, and forming a cutting opening on each of the signal leads
Data Source
AI summary
An array substrate, a manufacturing method thereof, and a display device are provided. The array substrate includes a display area and a non-display area in which a peripheral circuit is provided. The peripheral circuit includes a test area, a bonding area, and a cutting area. The test area is provided with a test signal line for providing a test signal. The bonding area is adjacent to the display area, and the bonding area and the test area are electrically connected through signal leads. The cutting area is disposed between the test area and the bonding area. After a cutting process is completed in the cutting area, a cutting opening is formed on each signal lead. A position of the cutting opening of at least one signal lead is different from positions of the cutting openings of other signal leads in height along an extending direction of the signal leads.