Array Substrate Light Transmission Holes for In-Screen Fingerprint

The light transmission holes are formed in the light shielding layer before the active layer is deposited. This preliminary action allows the holes to be created when the light shielding layer is still accessible, avoiding the need for complex subsequent patterning steps through the active layer. The holes are formed using standard photolithography and etching processes on the light shielding layer, then the active layer is deposited conformally over the holes and planarized, seamlessly integrating the light transmission features into the existing manufacturing flow without adding significant process steps.

The solution moves the light transmission hole creation from the horizontal plane (spacing concerns) to the vertical dimension by forming holes through the light shielding layer that extend downward to the imaging device. This vertical pathway allows light to transmit directly from the imaging device through the holes without requiring large horizontal spacing. The active layer can be deposited conformally over the holes and then planarized, preserving crystal morphology while maintaining close proximity for optimal light transmission intensity.

The light transmission holes are formed in the light shielding layer before the active layer is deposited. This preliminary action allows the holes to be created using standard photolithography and etching processes when the light shielding layer is still the top layer, avoiding the need for complex subsequent patterning steps through the active layer. The holes are then filled with insulating material and planarized, creating a flat surface for subsequent active layer deposition. This approach maintains high alignment precision because the hole positions are established early when alignment tools have optimal access, and the conformal deposition and planarization steps ensure that the active layer automatically aligns with the underlying hole structures.