Array Substrate Metal Connection Layout for Uniform TFT Current
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Solution Overview
Problem
Conventional array substrates face issues with uneven current distribution in transistors due to high square resistance in semiconductor connection parts, leading to performance discrepancies and display mura in Micro LED displays.
Innovation Solution
Incorporating a first metal part with higher conductivity, electrically connected to the semiconductor connection part, which reduces square resistance and enhances current uniformity, improving the performance consistency of transistors and display quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If semiconductor connection parts are used to connect channels, then the device structure is simple and manufacturing is easy, but the square resistance is high causing uneven current distribution
Solution Approach 1:
The patent combines semiconductor materials with metal materials to form a composite connection structure. The semiconductor pattern includes both a channel portion (semiconductor material) and a connection part (metal material), creating a composite structure that leverages the low resistance of metals while maintaining the functional properties of semiconductor channels. This resolves the contradiction by achieving both ease of manufacture and improved current uniformity.
Solution Approach 2:
The patent applies different material properties to different parts of the semiconductor pattern. The channel portion uses semiconductor material optimized for transistor operation, while the connection part uses metal material optimized for low resistance. This local differentiation of material quality allows each part to perform its specific function optimally, solving the current uniformity issue without compromising manufacturing simplicity.
2Device complexity
If conventional transistor structures are used, then the device complexity is low, but the current distribution in on state is uneven affecting display quality
Solution Approach 1:
The transistor structure incorporates a composite semiconductor pattern with metal connection parts integrated into the channel structure. This composite design improves current distribution uniformity and display quality while maintaining relatively simple device architecture, thus resolving the contradiction between device complexity and manufacturing precision.
Solution Approach 2:
The patent introduces metal materials specifically in the connection parts of the transistor structure, while maintaining conventional semiconductor materials in the active channel regions. This localized enhancement of material quality improves current uniformity and display quality without significantly increasing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively improves current uniformity and consistency in transistors, thereby enhancing display quality by reducing square resistance and aligning actual performance with simulated performance.
Implementation Method 1
The first metal part overlaps with the first connection part and is electrically connected to the first connection part
Data Source
AI summary
An array substrate, a display panel and a display device are provided. The array substrate includes a semiconductor pattern, a first gate, a second gate and a first metal part. The semiconductor pattern includes a first channel overlapping with the first gate, a second channel overlapping with the second gate, and a first connection part connecting the first channel with the second channel. The first metal part overlaps with the first connection part and is electrically connected to the first connection part. According to the embodiments of the present disclosure, it is beneficial to improving the uniformity of current distribution of a transistor.