Array Substrate Metal Pattern Hardness for Cutting Deformation
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Solution Overview
Problem
The existing cutting process for color film substrates in LCD display manufacturing causes deformation and irreversible breakage of the array substrate's metal trace, leading to abnormal display panels and reduced product yields due to the mismatched cutting lines and force applied during cutting.
Innovation Solution
The array substrate design includes a second region with an inorganic layer, an electrically conductive line, and metal patterns between the substrate and the conductive line, which increases the hardness of the film layer structure and reduces deformation during cutting, preventing breakage of the conductive line by strategically placing these metal patterns under the cutting boundaries.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the color film substrate is cut closer to the display region to reduce spacing, then the display panel area is increased, but the array substrate metal trace breaks due to cutting force deformation
Solution Approach 1:
The patent applies different material properties to different regions of the array substrate. Specifically, it introduces a glass coating layer in the second region (non-display region) where the cutting line is located, while the first region (display region) maintains its original structure. This local modification increases hardness precisely where cutting forces are applied, without affecting the display quality or other regions.
Solution Approach 2:
The patent creates a composite structure by adding a glass coating layer to the array substrate's second region. This glass coating forms a composite material system that combines the original substrate properties with the high hardness of glass, enabling the structure to withstand cutting forces while maintaining the functionality of the metal traces.
2Strength
If the array substrate is made harder to resist cutting deformation, then the metal trace breakage is prevented, but the manufacturing complexity increases
Solution Approach 1:
Instead of making the entire array substrate harder, the patent applies the glass coating layer only to the second region (non-display region) where the cutting line is located. This localized approach increases hardness precisely where needed to resist cutting deformation, while keeping the rest of the substrate simple and maintaining manufacturing efficiency.
Solution Approach 2:
The patent applies the glass coating layer partially, only in the region where cutting forces are applied (second region), rather than throughout the entire substrate. This partial application is sufficient to prevent metal trace breakage during cutting, while avoiding the added complexity and cost of coating the entire substrate.
Data Source
AI summary
An array substrate and a display panel are provided. The array substrate includes a first region and a second region. The first region corresponds to a display region of the display panel. The second region corresponds a non-display region of the display panel. The second region includes a substrate and an electrically conductive line formed on the substrate. The second region further includes at least one metal pattern formed between the substrate and the electrically conductive line.