Array Substrate Layout Without ITO for Fewer Mini-LED Masks
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Solution Overview
Problem
Conventional sub-millimeter light-emitting diodes (mini-LEDs) face numerous manufacturing processes, which complicate production and increase costs.
Innovation Solution
A fabrication method for an array substrate that utilizes a patterned black negative-type photoresist layer as an etching barrier during dry etching, simplifying the process by replacing indium tin oxide and reducing the number of photomasks needed, while using optimized conductive materials to enhance conductivity and prevent oxidation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional sub-millimeter LED manufacturing processes are used, then the product achieves functional requirements, but the number of manufacturing processes becomes excessive and production complexity increases
Solution Approach 1:
The patent combines multiple separate manufacturing processes into an integrated approach. Specifically, the black negative photoresist layer serves dual functions as both a pattern definition layer and an etching barrier layer, merging what were previously separate process steps into one unified layer that performs multiple critical functions simultaneously.
Solution Approach 2:
The black negative photoresist layer is designed to perform multiple functions: it defines the pattern for the conductive electrode, serves as the etching barrier layer during dry etching of the second insulating layer, and protects underlying structures. This multi-functionality eliminates the need for separate indium tin oxide layers and additional photomasks, directly reducing manufacturing process complexity.
2Manufacturing precision
If multiple photomasks are used for patterning different layers, then manufacturing precision is maintained, but production time and costs increase
Solution Approach 1:
The black negative photoresist layer serves as a universal pattern definition layer for multiple subsequent etching processes. Instead of using separate photomasks for different layers, this single photoresist pattern guides the formation of the conductive electrode through the second insulating layer, reducing the number of photomasking steps while maintaining patterning precision.
Solution Approach 2:
The photoresist layer is prepared in advance with the complete pattern information needed for subsequent etching processes. This preliminary patterning action enables multiple etching steps to proceed without additional photomasks, as the pre-formed photoresist pattern serves as the template for all subsequent material removal operations.
3Reliability
If indium tin oxide is used as a conductive layer, then electrical connectivity is achieved, but additional manufacturing steps and materials are required
Solution Approach 1:
The patent extracts and eliminates the indium tin oxide layer from the manufacturing process entirely. Instead of depositing and patterning a separate indium tin oxide conductive layer, the invention uses the black negative photoresist layer itself as the etching barrier, allowing the conductive electrode to be formed directly through the second insulating layer without requiring the indium tin oxide intermediate layer.
Solution Approach 2:
The black negative photoresist layer replaces the functional role previously fulfilled by indium tin oxide. Rather than using indium tin oxide as a conductive bridge layer, the photoresist layer directly serves as the etching barrier that enables conductive electrode formation, eliminating the need for separate conductive material deposition and simplifying the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies production processes, reduces costs, and improves efficiency by minimizing photomask usage and enhancing signal transmission capacity, while maintaining the integrity of the photoresist layer and etching equipment.
Implementation Method 1
removing the second conductive member and the second insulating layer corresponding to the conductive electrode by a dry etching using the patterned black negative-type photoresist layer as an etching barrier layer
Implementation Method 2
removing the second conductive member and the second insulating layer corresponding to the conductive electrode by a dry etching using the patterned black negative-type photoresist layer as an etching barrier layer
Data Source
AI summary
The present application provides an array substrate and a fabrication method thereof, and a display device. By etching a second insulating layer using a patterned black negative-type photoresist layer as an etching barrier layer, a second conductive member for transmitting electrical signals and having a same layer as source/drain electrodes is exposed. The second conductive member replaces an indium tin oxide in conventional technology to electrically connect a driving chip, thereby reducing processes of forming indium tin oxide and use of a photomask, simplifying production process, saving production costs, and improving production efficiency.