Array Substrate Layout With Bendable Bonding Region for Narrow Bezel Displays
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Solution Overview
Problem
The challenge is to create a display panel with a reduced frame size and improved display effect, as traditional glass substrates with driving circuits cannot be bent to minimize the frame, leading to larger gaps in large-size display screens.
Innovation Solution
The solution involves an array substrate with a bonding region and a non-bonding region, featuring a rigid substrate, a driving circuit layer, a light-emitting diode layer, a flexible base layer, and a bonding wire layer. The bonding wire layer and flexible base layer can be bent along the edge of the rigid substrate, allowing the circuit board to be connected on the back side, thus reducing the frame size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a traditional glass substrate with driving circuits is used, then the structural stability is maintained, but the frame size cannot be reduced due to inability to bend
Solution Approach 1:
The substrate is divided into two distinct regions: a rigid substrate region providing structural stability and a flexible base layer region enabling bending. This segmentation allows different parts of the same substrate to have different mechanical properties, resolving the contradiction between maintaining stability and enabling frame size reduction through bending.
Solution Approach 2:
Different regions of the substrate are assigned different local qualities: the rigid substrate region maintains structural integrity while the flexible base layer region allows bending. This local differentiation enables the substrate to simultaneously provide stability where needed and flexibility where needed for frame size reduction.
2Length of moving object
If the driving circuit layer is placed on the front side of the rigid substrate, then the electrical connection is simplified, but the frame size increases due to inability to bend the circuit board to the back side
Solution Approach 1:
Instead of connecting the circuit board to the front side of the rigid substrate, the circuit board is inverted and connected to the back side through the flexible base layer. This inversion allows the bonding wire layer to extend and connect to the circuit board on the opposite side, enabling frame size reduction while managing connection complexity through the flexible intermediate layer.
Solution Approach 2:
The flexible base layer acts as an intermediary between the rigid substrate with driving circuits and the circuit board. It mediates the connection by allowing the bonding wire layer to extend from the driving circuit layer through the flexible base layer to the circuit board on the back side, enabling frame size reduction while maintaining electrical connectivity.
3Length of moving object
If the bonding wire layer is extended to the back side for circuit board connection, then the frame size is reduced, but the manufacturing precision becomes more difficult to control
Solution Approach 1:
The flexible base layer is implemented as a thin film structure that allows the bonding wire layer to extend to the back side for circuit board connection. This thin film approach enables frame size reduction while the controlled thickness and material properties of the flexible layer help maintain manufacturing precision by providing a stable yet flexible platform for wire bonding.
Data Source
AI summary
An array substrate and a manufacturing method thereof, a display panel, and a display device are provided. The array substrate includes a bonding region and a non-bonding region, and further includes: a rigid substrate, in the non-bonding region; a driving circuit layer, in the non-bonding region; a light-emitting diode layer, on a side of the driving circuit layer away from the rigid substrate; a flexible base layer, in the bonding region and on the same side of the rigid substrate as the driving circuit layer; and a bonding wire layer, on a side of the flexible base layer away from the rigid substrate. The bonding wire layer and the flexible base layer is capable of being bent along an edge of the rigid substrate to a side of the rigid substrate away from the driving circuit layer.