Array Substrate One-Time Patterning Process
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Solution Overview
Problem
The manufacturing process of transparent amorphous oxide semiconductor TFTs is complex, requiring at least five patterning processes and resulting in high manufacturing costs due to the need for multi-layer protection for performance stability.
Innovation Solution
A method that forms a channel region, source electrode, and drain electrode via a one-time patterning process using a metal oxide layer, followed by heat treatment in hydrogen gas to achieve conductivity, reducing the number of patterning processes and manufacturing time while lowering costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple patterning processes are used to form channel region, source electrode and drain electrode, then manufacturing precision can be maintained, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the formation of channel region, source electrode, and drain electrode into a single patterning process. A metal oxide layer with different etching rates is deposited and patterned once to simultaneously define all three regions, eliminating the need for separate patterning steps for each component.
Solution Approach 2:
The patent applies local quality by using a metal oxide layer with spatially varying etching rates. Different regions of the same layer (channel, source, drain) have different etching characteristics that allow selective formation during a single etching process, enabling precise local differentiation without multiple patterning steps.
2Reliability
If multiple protection layers are added to ensure TFT performance stability, then reliability improves, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent extracts the protection function from separate ESL and PVX layers and integrates it into the metal oxide layer itself. The metal oxide layer serves dual purposes: as the functional TFT structure (channel, source, drain) and as its own protection layer, eliminating the need for additional protection layers.
Solution Approach 2:
The metal oxide layer performs multiple functions simultaneously: it forms the channel region, source electrode, and drain electrode, while also serving as a protection layer for the underlying structures. This multi-functionality reduces the total number of layers needed in the device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Simplifies the manufacturing process, shortens production time, and lowers the cost of the array substrate by reducing extra patterning processes and metal layer deposition, while maintaining performance stability through the use of IGZO or ZnO metal oxide layers.
Implementation Method 1
carrying out a heat treatment on the metal oxide layer of the source region and the drain region in hydrogen gas, and thereby forming a conducting source electrode and a conducting drain electrode
Data Source
AI summary
The present invention provides an array substrate and a method for manufacturing the same, and a display device. In the method for manufacturing the array substrate, a one-time patterning process is employed to form a channel region, a source electrode and a drain electrode of the array substrate. Specifically, a channel region, a source region and a drain region that are consisted of a metal oxide layer are formed via a one-time patterning process, and a heat treatment is carried out on the metal oxide layer of the source region and the drain region in hydrogen gas, thereby forming a conducting source electrode and a conducting drain electrode, respectively. By the technical solution of the invention, the manufacturing process of the array substrate can be simplified, and the manufacturing cost of the array substrate can be lowered.