Array Substrate Overlap Layout for Stable Signal Line Connection
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Solution Overview
Problem
Existing display technologies face issues with electrical connection quality between signal lines due to electrostatic breakdown caused by non-overlapping projections of signal lines, leading to potential circuit breaks and signal transmission delays.
Innovation Solution
An array substrate design featuring overlapping rectangular areas for conductive sections of signal lines with via holes penetrating insulating and passivation layers, utilizing comb-shaped structures and transparent conductive materials to ensure electrical connectivity and prevent point discharge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If via holes are formed to connect signal lines between layers, then electrical connection is achieved, but electrostatic breakdown may occur causing circuit breaks
Solution Approach 1:
The patent transitions from a conventional point-to-point via hole connection to a planar overlapping conductive section design. By making the orthographic projections of conductive sections overlap in the horizontal plane, the connection is distributed across an area rather than concentrated at a single point, preventing electrostatic breakdown while maintaining electrical connectivity between layers.
Solution Approach 2:
The conductive sections are divided into multiple distributed regions with overlapping projections. Instead of a single continuous conductive path, the design segments the conductive area into multiple zones that overlap when viewed from above, creating multiple parallel electrical pathways that reduce the risk of complete failure from electrostatic damage at any single location.
2Productivity
If conventional non-overlapping signal line arrangements are used, then manufacturing is simpler, but signal transmission delays occur
Solution Approach 1:
The patent utilizes the horizontal plane dimension to create overlapping projections of conductive sections, effectively adding a spatial dimension to the electrical connection path. This overlapping arrangement shortens the effective signal transmission distance by creating more direct electrical pathways between layers, thereby reducing signal transmission delays compared to conventional non-overlapping arrangements.
3Reliability
If overlapping conductive sections are implemented, then electrostatic breakdown is prevented, but manufacturing complexity increases
Solution Approach 1:
The patent merges the conductive sections of different layers such that their orthographic projections overlap in the horizontal plane. This merging approach allows the conductive patterns to be formed using standard photolithography and etching processes, integrating the overlapping design into existing manufacturing workflows without requiring fundamentally new fabrication techniques, thus managing complexity while achieving electrostatic protection.
Data Source
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AI summary
The present disclosure provides an array substrate, which includes a first signal line and a second signal line arranged on a substrate as different layers that are insulating and spaced apart from each other, wherein one end of the first signal line comprises a first conductive section, one end of the second signal line comprises a second conductive section, the first conductive section and the second conductive section are electrically connected through a connecting structure, and wherein orthographic projections of an area where the first conductive section is located and an area where the second conductive section is located overlap at least partially. The array substrate can reduce the possibility of occurrence of circuit break between signal lines and improve the effect of connection between different signal lines.