Array Substrate Composite Passivation Layers Adhesion

The patent employs a composite passivation structure consisting of multiple layers with different materials (SiOx, SiOxNy, SiNx) to achieve superior adhesion and reliability. Each layer contributes different properties: SiOx provides good adhesion to ITO, SiOxNy provides intermediate adhesion, and SiNx provides water and oxygen barrier properties. This composite approach resolves the contradiction by combining multiple materials to achieve high reliability while maintaining a systematic and manufacturable structure.

The patent introduces groove structures that penetrate through the passivation layers to create physical separations between adjacent conductive elements. These grooves segment the passivation layers, preventing direct contact between conductive elements from different layers and thus preventing short circuits. The segmentation is achieved through controlled etching processes that create these separating structures, balancing reliability improvement with manufacturing feasibility.

The patent applies anisotropic conductive adhesive specifically within the groove structures where electrical connections are needed. The adhesive has directional conductivity properties that allow electrical connection in the vertical direction (through the groove) while maintaining insulation in horizontal directions. This local application of specialized material with directionally selective properties improves electrical connection reliability while the groove structure provides a defined space that reduces precision requirements compared to direct bonding approaches.