Array Substrate Plug-in Signal Board Connection Reducing Interference
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Solution Overview
Problem
The large number of signal lines between signal boards in liquid crystal display devices leads to signal quality interference and complicates assembly and disassembly due to wire crossovers on flexible printed circuit boards.
Innovation Solution
Implementing a plug-in connection mode between signal boards, where a first plug-in structure on one board corresponds to a second plug-in structure on another, reducing the number of signal lines and facilitating assembly and disassembly, with various plug-in structures such as pins, USB plugs, hanging hooks, and clamping strips being used for electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a large number of signal lines are arranged between signal boards, then signal transmission capacity is improved, but signal quality is degraded due to mutual interference and assembly difficulty increases due to wire crossovers
Solution Approach 1:
The patent divides the signal transmission function into multiple independent layers. Signal lines are segmented across different layers of the FPC, with odd-numbered signal lines on one layer and even-numbered signal lines on another layer. This segmentation prevents wire crossovers and reduces mutual interference, allowing more signal lines to be arranged without degrading signal quality.
Solution Approach 2:
The patent transitions from a two-dimensional planar arrangement of signal lines to a three-dimensional multi-layer structure. By utilizing the vertical dimension (different layers of the FPC), the patent accommodates a larger quantity of signal lines without increasing the footprint area, while avoiding wire crossovers that would occur in a single-layer dense arrangement.
2Quantity of substance
If a large number of signal lines are arranged between signal boards, then signal transmission capacity is improved, but assembly and disassembly difficulty increases due to wire crossovers
Solution Approach 1:
The FPC is divided into multiple layers with signal lines segmented across these layers. This segmentation eliminates wire crossovers, resulting in a cleaner, more organized connection structure that is easier to assemble and disassemble. The modular layer structure allows for simpler handling during assembly operations.
Solution Approach 2:
By arranging signal lines on multiple layers rather than forcing them into a single plane, the patent creates a more manageable three-dimensional structure. This multi-layer arrangement reduces complexity in the connection interface, making assembly and disassembly operations easier despite the increased quantity of signal lines.
3Ease of manufacture
If signal lines are arranged on a single layer, then assembly is simplified, but the quantity of signal lines is limited and wire crossovers occur
Solution Approach 1:
The patent utilizes the vertical dimension by implementing multiple layers in the FPC structure. This allows signal lines to be distributed across different layers, significantly increasing the total quantity of signal lines that can be accommodated while maintaining a systematic arrangement that does not compromise assembly simplicity.
Solution Approach 2:
Signal lines are segmented and assigned to different layers based on their routing requirements. This segmentation allows for optimized signal paths without crossovers, while the modular layer structure maintains assembly simplicity through standardized inter-layer connections.
Data Source
AI summary
A display device and an array substrate are disclosed. The display device includes a display panel and signal boards which supply signals to the display panel. At least a pair of signal boards that are connected with each other is electrically connected using a plug-in connection mode. A first plug-in structure is provided on a first signal board of each pair of signal boards connected in the plug-in connection mode, and a second plug-in structure corresponding to the first plug-in structure is provided on a second signal board of the pair of signal boards connected in the plug-in connection mode. Because at least a pair of signal boards that are connected with each other is electrically connected using a plug-in connection mode, a quantity of signal lines arranged between signal boards is reduced, which enables assembly and disassembly be more convenient.