Array Substrate Protrusion Patterns for Under-Display Camera Border Reduction
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Solution Overview
Problem
Current under-display camera technology in OLED display panels faces issues with poor packaging reliability and reduced screen ratio due to the formation of borders by groove structures and winding areas, which affect the full screen experience.
Innovation Solution
The proposed solution involves an array substrate with layer-stacked first, second, and third wiring patterns, along with an undercut structure within the winding area, which reduces the border width and integrates with the active area components, potentially reducing the number of photomasks required.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If groove structures with undercut structure are provided under the transistor structure at the boundary between active area and camera area, then packaging reliability is improved by protecting the active area from moisture or oxygen, but the border width increases reducing the screen ratio
Solution Approach 1:
The patent transitions from a planar groove structure to a three-dimensional protrusion structure extending vertically from the substrate. The protrusion structure includes a first protrusion in the camera area and a second protrusion in the active area, connected by a bridge portion, creating a vertical dimension that reduces horizontal border width while maintaining protective function.
Solution Approach 2:
The protrusion structure is integrated within the existing substrate and wiring layer structure. The first and second protrusions are formed from the substrate with wiring layers deposited thereon, nesting the protective structure within the existing device architecture rather than adding external border elements.
2Ease of manufacture
If metal signal lines are arranged in parallel to surround the hole forming a winding area, then the camera area is defined, but the border width increases reducing the full screen experience
Solution Approach 1:
The patent uses the vertical dimension by forming protrusions that extend upward from the substrate. The bridge portion connects protrusions at different locations, creating a three-dimensional structure that defines the camera area boundary without requiring wide horizontal spacing between parallel wiring lines.
Solution Approach 2:
The protective protrusion structure is merged with the wiring layer structure. The wiring layers are deposited on the protrusions, integrating the boundary definition function with the electrical signaling function in a single integrated structure rather than separate parallel elements.
3Reliability
If multiple groove structures are provided in parallel under the transistor structure, then packaging reliability is improved, but the complexity of the structure increases
Solution Approach 1:
The patent merges multiple protective functions into a single integrated protrusion structure. The first protrusion, second protrusion, and bridge portion work together as one continuous structure, eliminating the need for separate parallel groove structures while maintaining the protective function against moisture and oxygen.
Solution Approach 2:
The protrusion structure is segmented into functional portions: a first protrusion in the camera area, a second protrusion in the active area, and a bridge portion connecting them. This segmentation allows each portion to serve specific protective functions while forming a unified structure that is simpler than multiple independent groove structures.
Data Source
AI summary
An array substrate and a method of fabricating the same are described. The array substrate has an active area and a winding area, wherein the array substrate has a base substrate, an active layer, a first insulating layer, a first metal layer, a second insulating layer, a second metal layer, a third insulating layer, a third metal layer, a patterned flat layer, a pixel defining layer, and a support layer. The first metal layer has at least one first wiring pattern. The second metal layer has at least one second wiring pattern. The third metal layer has at least one third wiring pattern. The pixel defining layer together with the support layer within the winding area have at least one undercut structure. The array substrate and the method of fabricating the same can reduce a width of a boundary formed by the winding area.