Array Substrate Fabrication via Recess Filling Annealing
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Solution Overview
Problem
Conventional methods for fabricating array substrates in liquid crystal display devices face issues such as electrical shorts and line opens due to inadequate recess formation between common and pixel electrodes, and high temperatures used in forming passivation layers can crystallize indium tin oxide, leading to performance defects.
Innovation Solution
A method involving the formation of a first conductive material layer on a base substrate, followed by an insulating layer that covers part of the conductive material and exposes another part, with subsequent over-etching to create a recess, and annealing to fill the recess with mobilized insulating material, thereby forming electrodes insulated from each other, using a resin material that requires lower temperatures and simplifies the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a passivation layer is formed at high temperature to provide insulation between electrodes, then insulation performance is improved, but the indium tin oxide conductive material crystallizes leading to performance defects
Solution Approach 1:
The patent changes the temperature parameter from high temperature (conventional passivation layer formation) to low temperature (annealing process). The annealing temperature is specifically controlled to be lower than the crystallization temperature of indium tin oxide, thereby preventing crystallization while still achieving the desired insulation effect through the resin layer solidification.
Solution Approach 2:
The patent introduces a resin layer as an intermediary insulating material between the common electrode and pixel electrode. This resin layer serves as a mediator that provides the necessary insulation without requiring high temperature processing, thus avoiding the crystallization of the indium tin oxide conductive material while maintaining electrical insulation performance.
2Ease of manufacture
If conventional fabrication methods are used to form electrodes, then manufacturing process is simple, but electrical shorts and line opens occur due to inadequate recess formation
Solution Approach 1:
The patent performs preliminary action by forming the insulating layer (resin layer) before the etching step. This allows the recess to be formed with the insulating material already in place, ensuring that the insulating material flows into and fills the recess during subsequent annealing, thereby preventing electrical shorts before the electrodes are fully formed.
Solution Approach 2:
The resin layer performs self-service by automatically flowing into the recess formed during etching and filling it upon annealing. This self-filling mechanism eliminates the need for additional filling steps or complex recess formation processes, maintaining manufacturing simplicity while ensuring proper insulation and preventing electrical shorts.
3Reliability
If the insulating layer thickness is increased to improve insulation, then electrical isolation is enhanced, but the fabrication complexity and material consumption increase
Solution Approach 1:
The resin layer utilizes its own viscosity and thermal behavior during annealing to automatically flow into and fill the recess areas. This self-adjusting mechanism ensures that the insulating material distributes itself optimally to provide adequate electrical isolation without requiring excessive initial thickness or additional fabrication steps to achieve proper insulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents electrical shorts and line opens by ensuring proper insulation between electrodes and avoids crystallization of the conductive material, enhancing the resolution and electrical performance of the array substrate.
Implementation Method 1
annealing the insulating layer to mobilize a portion of the insulating layer above the recess and fill the recess with a mobilized insulating material
Data Source
AI summary
The present application discloses a method of fabricating an array substrate. The method includes forming a first conductive material layer on a base substrate; forming an insulating layer on a side of the first conductive material layer distal to the base substrate, the insulating layer formed to cover a first part of the first conductive material layer, exposing a second part of the first conductive material layer; over-etching the first conductive material layer to remove the second part of the first conductive material layer, and remove a portion of a periphery of the first part of the first conductive material layer to form a recess between the insulating layer and the base substrate, thereby forming a first electrode; and subsequent to forming the first electrode and the recess, annealing the insulating layer to mobilize a portion of the insulating layer above the recess and fill the recess with a mobilized insulating material.