Array Substrate Recessed Structure for Chip-on-Film Bonding Integrity
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Solution Overview
Problem
In full screen display designs, the array substrate's larger area compared to the color filter leads to a bonding region that is prone to gaps under lateral forces, allowing water vapor entry and causing short circuits due to the weaker adhesiveness between the bonding material and the base substrate compared to the chip-on-film.
Innovation Solution
A recessed structure is introduced between the chip-on-film bonding region and the lateral side of the array substrate, filled with a bonding material, which reduces the likelihood of gaps forming between the chip-on-film and the array substrate by providing a frictional seal, preventing water vapor entry and maintaining bonding integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the array substrate area is increased to achieve full screen design, then the display area is improved, but the bonding region becomes more prone to gaps under lateral forces
Solution Approach 1:
The bonding region is segmented into a flat bonding area and a recessed structure area. The recessed structure divides the bonding material into different zones (flat portion and filled portion), creating distinct functional regions that together improve bonding reliability while maintaining large display area.
Solution Approach 2:
The bonding structure transitions from a two-dimensional flat surface to a three-dimensional structure with a recessed portion. This vertical dimension addition creates a friction seal that prevents water vapor penetration, solving the reliability issue without reducing display area.
2Strength
If the bonding material adhesiveness to base substrate is weaker than to chip-on-film, then the chip-on-film bonding is improved, but gaps form under lateral forces allowing water vapor entry
Solution Approach 1:
The recessed structure acts as an intermediary mechanical feature that enhances the bonding interface. By creating a friction seal through the filled recessed portion, it mediates between the weak substrate-adhesive interface and the strong chip-on-film adhesive interface, preventing water vapor penetration.
Solution Approach 2:
The recessed structure is pre-formed in the array substrate before bonding. This preliminary structural preparation creates a friction seal that cushions against lateral forces and prevents water vapor entry before any gaps can form under operational stress.
3Reliability
If a recessed structure is added to prevent gaps and water vapor entry, then bonding reliability is improved, but device complexity increases
Solution Approach 1:
The recessed structure is implemented locally only in the bonding region where it is needed, rather than throughout the entire substrate. This localized approach improves bonding reliability while minimizing the increase in overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The recessed structure effectively reduces the defect ratio and improves product quality by preventing corrosion and short circuits, even under excessive lateral forces, by ensuring the bonding material remains sealed within the recessed area.
Implementation Method 1
providing a frictional seal, preventing water vapor entry and maintaining bonding integrity
Implementation Method 2
a bonding material that bonds the array substrate and the chip-on-film
Data Source
AI summary
Provided are an array substrate, a display panel and a display device. The array substrate includes a display region and a peripheral region. The peripheral region includes a chip-on-film bonding region, and the peripheral region has a recessed structure configured to fill a bonding material. The recessed structure is between the chip-on-film bonding region and a lateral side of the array substrate. The chip-on-film bonding region is between the display region and the lateral side. By disposing a recessed structure configured to fill the bonding material in the peripheral region, a gap is difficult to occur between the chip-on-film in the chip-on-film bonding region and the array substrate, preventing entry of water vapor to cause corrosion of lead wires and short circuits of lead wires. The defect ratio of the array substrate, the display panel, and the display device is reduced, and the product quality is improved.