Array Substrate Reflection Layer Anti-Deterioration Via Holes

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Solution Overview

Problem

Current liquid crystal display panels require a backlight source, increasing volume and power consumption, and suffer from deteriorated via holes in non-display areas leading to poor contact resistance and display quality.

Innovation Solution

An array substrate with a reflection layer in the display area and an anti-deterioration layer in both display and non-display areas, using materials like aluminum and molybdenum, respectively, to reflect external light and prevent corrosion, thereby improving light utilization and contact resistance without additional masking processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If a backlight source is used to achieve display, then display visibility is improved, but volume and power consumption increase

Engineering Contradiction:
Improvedisplay visibilityVSAvoidpower consumption
Core Design Contradiction:
Illumination intensityVSUse of energy by stationary object

Solution Approach 1:

Instead of using a backlight source to illuminate the display from behind, the patent inverts the approach by using a reflection layer to reflect ambient light from the front. The reflection layer is configured to reflect light irradiated from an external light source, converting the display mode from active emission to passive reflection, thereby eliminating the backlight source and reducing power consumption while maintaining display visibility

Inventive Principle:
Principle #13The other way round (Inversion)

Solution Approach 2:

The display structure utilizes external ambient light sources (such as natural light or room lighting) to achieve display visibility without requiring an internal backlight source. The reflection layer serves the display function by reflecting externally provided light, allowing the display to 'service itself' using environmental resources rather than consuming additional power for illumination

Inventive Principle:
Principle #25Self-service

2Reliability

If via holes are formed in non-display areas for connection, then electrical connectivity is improved, but contact resistance increases due to deterioration

Engineering Contradiction:
Improveelectrical connectivityVSAvoidcontact resistance
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies preliminary anti-action by forming an anti-deterioration layer in advance within the via holes before electrical connections are established. This anti-deterioration layer prevents oxidation and corrosion of the via hole structures, counteracting the harmful effects of environmental exposure and ensuring long-term electrical connectivity with stable contact resistance

Inventive Principle:
Principle #9Preliminary anti-action

Solution Approach 2:

The patent employs composite material structures in the via holes, combining conductive materials for electrical connectivity with anti-deterioration materials (such as tungsten or molybdenum) that resist oxidation and corrosion. This composite approach within the via hole structure simultaneously achieves both electrical connectivity and resistance to deterioration, solving the contradiction between reliability and harmful factors

Inventive Principle:
Principle #40Composite materials

3Manufacturing precision

If additional masking processes are used to form anti-deterioration layers, then via hole quality is improved, but manufacturing complexity increases

Engineering Contradiction:
Improvevia hole qualityVSAvoidmanufacturing process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent merges the formation of the reflection layer and the anti-deterioration layer into a single integrated structure. The anti-deterioration layer is formed as part of the same thin-film deposition process that creates the reflection layer, eliminating the need for separate masking and deposition steps. This integration maintains via hole quality by ensuring proper material placement while significantly reducing manufacturing process complexity

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables complete reflection display without a backlight source, enhances light utilization, and prevents deterioration of via holes, improving display quality and product yield.

Implementation Method 1

each of the plurality of pixel regions is provided with a reflection layer at a side facing a display side, the reflection layer is configured to reflect light irradiated thereon from an external light source to form a display image

Methodology Applied
Scientific EffectLight reflection: Reflection

Data Source

PatentUS11189641B2Method for manufacturing array substrate, array substrate and display apparatus
Publication Date: 2021.11.30 BOE TECHNOLOGY GROUP CO LTD
  • US11189641B2 patent drawing
  • US11189641B2 patent drawing
  • US11189641B2 patent drawing

AI summary

An array substrate, a manufacturing method thereof, and a display apparatus are provided. The array substrate includes a display area and a non-display area in the periphery of the display area, the display area includes pixel regions, the display and non-display areas are provided with via holes, wherein each pixel region is provided, at a side facing a display side, with a reflection layer configured to reflect light irradiated thereon from an external light source to form a display image; and an anti-deterioration layer in contact with the reflection layer is provided in the via holes in the display and non-display areas. Thus, by using a new material, utilization of external light source is improved without additional masking process, and connection in via holes in the display area, and especially in the non-display area is achieved, which prevents deterioration of the via holes and poor contact resistance.