Array Substrate Repair Lines and Vias for Signal Line Defects
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Solution Overview
Problem
Conventional array substrates face challenges in repairing signal line defects such as open circuits and short circuits, which are difficult and costly to address, leading to manufacturing inefficiencies and increased costs.
Innovation Solution
The array substrate design includes a first signal line layer, a second signal line layer, and insulating layers with repair lines and vias that allow for electrical connection between the layers, enabling effective repair of signal line defects by reconnecting damaged lines through strategically placed vias and repair lines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional repair methods are used for signal line defects, then defect resolution is achieved, but manufacturing cost increases and manufacturing efficiency decreases
Solution Approach 1:
The patent applies preliminary action by pre-configuring repair lines and vias during the manufacturing process before defects occur. The repair infrastructure (repair lines in the second metal layer and vias through insulating layers) is built in advance, allowing defects to be repaired by simply establishing electrical connections through these pre-positioned structures, rather than performing complex repair operations after defects are detected.
Solution Approach 2:
The patent uses repair lines as intermediary conductive paths that mediate between defective signal lines and functional circuitry. When a signal line defect is detected, the repair line serves as a substitute pathway, allowing electrical signals to bypass the defective section through the intermediary repair line and via connections, thereby restoring functionality without requiring complex surgical repair techniques.
2Ease of repair
If repair lines and vias are added to enable signal line repair, then ease of repair improves, but device complexity increases
Solution Approach 1:
The patent merges the repair function with the existing metal layer structure by integrating repair lines into the second metal layer and combining via structures with the insulating layer system. This consolidation allows the repair infrastructure to share manufacturing processes and structural elements with the functional signal lines, reducing overall device complexity despite adding repair capability.
Solution Approach 2:
The patent implements universality by designing the repair line and via structure to serve multiple functions: they provide repair capability for signal line defects while simultaneously maintaining normal signal transmission when no defects are present. The same structural elements serve both as functional conductors and as backup repair paths, eliminating the need for separate dedicated repair structures.
Data Source
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AI summary
The present application discloses an array substrate including a first signal line layer having a plurality of rows of first signal lines; a second signal line layer having a plurality of columns of second signal lines; the plurality of rows of first signal lines crossing over the plurality of columns of second signal lines defining a plurality of subpixels; a first insulating layer and a second insulating layer between the first signal line layer and the second signal line layer; the first insulating layer on a side of the second insulating layer proximal to the first signal line layer; a repair line between the first insulating layer and the second insulating layer, the repair line corresponding to one of the plurality of columns of second signal lines; and a first via and a second via extending through the second insulating layer; the repair line being electrically connected to the corresponding one of the plurality of columns of second signal lines through the first via and the second via, respectively.