Array Substrate Intermediate Resist Thickness Uniformity
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Solution Overview
Problem
The variation in intermediate resist film thickness during photo lithography in liquid crystal display device manufacturing leads to issues with thin film pattern formation, resulting in either the elimination of necessary patterns or the retention of unnecessary patterns due to non-uniform resist film thickness across different thin film patterns formed at the same step.
Innovation Solution
The solution involves forming an array substrate with multiple types of thin film patterns, where the resist is processed to achieve an intermediate exposure that does not completely expose the resist, ensuring that all patterns are formed at substantially the same height from the substrate, thereby maintaining uniform intermediate resist film thickness across different regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If intermediate exposure is performed on regions with various thin film patterns having different heights, then the photo lithography process can be applied to multiple pattern types, but the intermediate resist film thickness varies significantly across different regions
Solution Approach 1:
The patent applies local quality by forming a flattening film selectively in specific regions where thin film patterns of different heights exist. The flattening film is deposited only in regions requiring height compensation, not uniformly across the entire substrate. This localized approach equalizes the surface height in those specific areas, enabling uniform intermediate resist film thickness in regions where multiple thin film pattern types coexist, while maintaining the adaptability to process various pattern types.
2Ease of manufacture
If intermediate exposure is performed to reduce photo lithography steps, then production cost is reduced, but variation in intermediate resist film thickness causes elimination of necessary patterns or retention of unnecessary patterns
Solution Approach 1:
The patent applies preliminary action by forming the flattening film before the intermediate exposure process. This preparatory step ensures that the surface is pre-flattened in regions with height variations, so that when the intermediate exposure is subsequently performed, the resist film thickness is uniform across all regions. This preliminary surface preparation maintains pattern formation accuracy while allowing the cost-effective intermediate exposure method to be used.
3Adaptability or versatility
If thin film patterns of different compositions are formed at the same layer, then functional diversity is achieved, but heights from substrate differ causing non-uniform resist film thickness
Solution Approach 1:
The patent maintains the functional diversity of different thin film pattern compositions while applying local quality by selectively depositing flattening film only in regions where height variations occur. The flattening film compensates for height differences caused by different film compositions, enabling uniform resist film thickness in those specific regions without altering the underlying diverse thin film patterns or their functional properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in uniform intermediate resist film thickness, expanding the process margin, improving yield, and allowing for cost-effective manufacturing of array substrates and display devices by reducing defects and enhancing the consistency of thin film patterns.
Implementation Method 1
A method for reducing a photo lithography step is made practicable by performing GT exposure or HT exposure
Data Source
AI summary
An array substrate has regions in which an intermediate resist film thickness is formed and processed by an intermediate exposure amount which does not completely expose a resist, respectively on a drain electrode, source terminal, and a common connection wiring which are made of a second conductive film. Thin film patterns or a common wiring made of a first conductive film is formed in substantially entire regions on the bottom layers of the regions so that the heights from a substrate are substantially the same.