Array Substrate Motherboard Scale Pattern for Film Deviation Measurement
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Solution Overview
Problem
Current methods for monitoring the position deviation of films deposited on array substrate motherboards using PVD and CVD processes are inefficient due to low precision and high labor consumption, as they rely on manual measurement with millimeter-level graduated scales, leading to inaccuracies and time-consuming processes.
Innovation Solution
A method involving the deposition of a first film on a substrate with a gap, coating photoresist to form a scale pattern, and subsequent etching to create a second scale pattern, allowing for precise measurement of film edges using micron-level scale patterns, which are more efficient and accurate than manual methods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual measurement with graduated scale is used to monitor film position deviation, then the measurement process is simple to implement, but the measurement precision is low and labor consumption is high
Solution Approach 1:
The patent applies preliminary action by pre-forming scale patterns on the substrate before film deposition. These scale patterns serve as reference marks that enable automated image processing systems to accurately measure film position deviation without manual intervention during the actual measurement process, thereby resolving the contradiction between measurement precision and time consumption
Solution Approach 2:
The patent replaces the manual mechanical measurement system (graduated scale and human observation) with an automated optical image processing system. The scale patterns are captured through imaging and processed automatically to determine film position deviation, eliminating manual labor and significantly reducing measurement time while improving precision
2Measurement precision
If manual measurement with graduated scale is used to monitor film position deviation, then the measurement method is easy to implement, but labor consumption is high
Solution Approach 1:
The patent implements self-service by designing a system where the scale patterns automatically serve as their own measurement references. The imaging system captures the scale patterns and film edges, and the image processing algorithm automatically calculates position deviation without requiring human operators to manually align or read measurements, thus improving precision while maintaining operational simplicity
Solution Approach 2:
The patent substitutes manual mechanical measurement operations with automated optical imaging and digital image processing. The system automatically captures images, identifies scale patterns and film edges, and computes position deviations, eliminating the need for manual graduated scale reading while keeping the overall process simple and easy to operate
3Reliability
If large gap is maintained between film edge and substrate edge due to PVD/CVD process limits, then the film deposition process is reliable, but the array pattern cannot be formed at positions adjacent to the substrate edge
Solution Approach 1:
The patent introduces scale patterns as intermediary reference elements between the substrate edge and the film deposition process. These scale patterns are formed closer to the substrate edge than the film can reliably reach, serving as中介 markers that allow precise positioning and measurement of array patterns adjacent to the substrate edge without compromising film deposition reliability
Solution Approach 2:
The patent applies preliminary action by pre-forming scale patterns and conducting position measurements before final array pattern fabrication. This allows the process to account for and compensate for the necessary gaps in film deposition, enabling accurate positioning of array patterns near the substrate edge while maintaining reliable film formation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances measurement precision to micron-level, reduces labor and time consumption, and provides a more efficient way to determine film position deviations, improving the accuracy and speed of array substrate motherboard fabrication.
Implementation Method 1
depositing a metal or a metal oxide film through a PVD (physical vapor deposition) method
Implementation Method 2
depositing a single crystal, a polycrystalline or a compound film through a CVD (chemical vapor deposition) method
Implementation Method 3
exposing and developing the photoresist to form a first scale pattern by the photoresist
Data Source
AI summary
A method for fabricating an array substrate motherboard, an array substrate motherboard and a detection method are provided. The method for fabricating an array substrate motherboard includes depositing a first film on a substrate, wherein a first gap is present between the edge of the first film and the edge of the substrate, coating photoresist on the substrate on which the first film is deposited, and exposing and developing the photoresist to form a first scale pattern from the photoresist. One end of the first scale pattern is flush with the edge of the substrate and the other end covers the first film.