Array Substrate Conductive Shading Layer Copper Diffusion

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Solution Overview

Problem

The complexity of the fabricating process for array substrates is increased by the need for a black matrix layer, and copper atoms tend to diffuse into the active layer, reducing performance, especially when polysilicon is used.

Innovation Solution

Incorporating a conductive shading layer between the active layer and the copper layer, which also extends to function as a black matrix, preventing direct contact and diffusion, and using titanium for the shading layer to enhance adhesion and prevent light leakage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If a black matrix layer is added to prevent light leakage in shading regions, then image contrast is improved, but the fabricating process becomes more complex

Engineering Contradiction:
Improveimage contrastVSAvoidfabricating process complexity
Core Design Contradiction:
Illumination intensityVSDevice complexity

Solution Approach 1:

The patent combines the black matrix layer and copper layer into a single integrated structure. The copper layer is extended into the shading regions to simultaneously serve as both the electrical connection layer and the light-shading layer, eliminating the need for a separate black matrix layer while maintaining both electrical functionality and optical performance.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The copper layer is designed to perform multiple functions: it serves as the electrical connection layer for signal transmission and simultaneously functions as the black matrix layer for light shading in the display regions. This multi-functional design reduces the number of separate layers needed in the device structure.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If copper is used as the material for source and drain, then electrical conductivity is improved, but copper atoms diffuse into the active layer reducing performance

Engineering Contradiction:
Improveelectrical conductivityVSAvoidcopper diffusion
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent introduces a barrier layer between the copper layer and the active layer to prevent direct contact. This intermediary layer blocks the diffusion of copper atoms into the active layer while allowing the copper layer to maintain its electrical conductivity function for signal transmission.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Object-generated harmful factors

If a titanium layer is added between copper and active layer to prevent copper diffusion, then copper diffusion is prevented, but the device structure becomes more complex

Engineering Contradiction:
Improvecopper diffusion preventionVSAvoiddevice structure complexity
Core Design Contradiction:
Object-generated harmful factorsVSDevice complexity

Solution Approach 1:

The patent merges the black matrix layer and copper layer into a single integrated structure where the copper layer extends into the shading regions. This integration eliminates the need for an additional titanium barrier layer, as the extended copper structure simultaneously provides both electrical connection and light shading functions.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The copper layer is designed to perform multiple functions including electrical connection and light shading, reducing the need for additional specialized layers such as titanium barrier layers, thereby simplifying the overall device structure while maintaining functionality.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This simplifies the fabrication process by eliminating the need for a separate black matrix layer and effectively prevents copper diffusion into the active layer, maintaining performance and image contrast.

Implementation Method 1

the conductive shading layer is provided between the active layer and the copper layer

Methodology Applied
Scientific EffectDiffusion barrier: Diffusion Barrier

Implementation Method 2

at least a part of region of the shading region other than the source and the drain is provided with the conductive shading layer

Methodology Applied
Scientific EffectLight blocking: Absorption (EM radiation)

Data Source

PatentUS9847427B2Array substrate, method for fabricating the same, and display device
Publication Date: 2017.12.19 BOE TECHNOLOGY GROUP CO LTD
  • US9847427B2 patent drawing
  • US9847427B2 patent drawing
  • US9847427B2 patent drawing

AI summary

An array substrate and a method for fabricating the same, and a display device are disclosed. The array substrate comprises light-transmissive regions for display and shading regions, a plurality of thin film transistors are provided in the shading region, the thin film transistor comprises: a base substrate; an active layer, a gate insulating layer, a gate and a passivation layer sequentially provided on the base substrate; and a source and a drain provided on the passivation layer, the source and the drain comprise a conductive shading layer connected to the active layer and a copper layer provided on the conductive shading layer, the conductive shading layer is provided between the active layer and the copper layer, and at least a part of region of the shading region other than the source and the drain is provided with the conductive shading layer.