Array Substrate Layout to Prevent Mini-LED Layer Short Circuits
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Solution Overview
Problem
The overlapping areas between conductive layers in array substrates for Mini-LED displays lead to potential short circuits due to static electricity, fabricating processes, and testing, affecting product reliability and stability.
Innovation Solution
The design includes non-overlapping projections of conductive portions on the base substrate with defined opening areas, ensuring gaps between edges to prevent short circuits, and utilizing insulating layers to maintain electrical isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If conductive layers are designed with overlapping projections to achieve compact layout and high pixel density, then the area utilization is improved, but the risk of short circuits due to static electricity and fabricating process variations increases
Solution Approach 1:
The conductive layers are segmented into multiple conductive portions within each conductive layer, and the projections of these portions are designed to avoid overlapping with projections of conductive portions in other layers. This segmentation allows the conductive paths to be distributed without creating overlapping regions that could lead to short circuits, thus maintaining area utilization while improving reliability.
2Length of stationary object
If the conductive layers are positioned closer together to reduce substrate thickness and improve device compactness, then the device compactness is improved, but the electrical isolation between layers becomes more difficult to maintain
Solution Approach 1:
The design extracts the potential short circuit paths by ensuring that conductive portions in different layers do not have overlapping projections. This eliminates the need for thick insulating layers solely for isolation purposes, allowing the substrate thickness to be reduced while maintaining electrical isolation through the non-overlapping conductive geometry.
3Reliability
If opening areas are added to conductive portions to prevent short circuits, then the reliability is improved, but the manufacturing complexity increases due to additional patterning steps
Solution Approach 1:
Instead of adding opening areas to existing conductive portions to prevent short circuits, the invention inverts the approach by designing the conductive portions themselves to have non-overlapping projections from the outset. This eliminates the need for additional opening areas and associated patterning steps, maintaining reliability while simplifying manufacturing.
Data Source
AI summary
An array substrate includes a base substrate, a first conductive layer and a second conductive layer. The first conductive layer is provided on a side of the base substrate and includes a first conductive portion. The second conductive layer is provided on a side of the first conductive layer away from the base substrate and includes a second conductive portion. The projection of at least part of the second conductive portion on the base substrate and the projection of the first conductive portion on the base substrate do not overlap. The first conductive portion is provided with an opening area, and a projection of at least part of the second conductive portion on the base substrate is located in an area enclosed by a projection of the opening area.


