Array Substrate Sidewall Wiring Bypasses Thick Color-Resist Via Holes
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Solution Overview
Problem
The challenge of drilling via-holes in color-resist layers with high film thickness for large curved displays leads to issues such as color-resist residues and wire breakage during metal climbing, affecting process yield and display quality.
Innovation Solution
An array substrate design that includes a signal lead-out structure with an insulating boss and signal lead-out wires extending along its sidewall, where the color-resist layer thickness is less than or equal to the extension length of the signal lead-out wire, allowing electrical connection without via-holes, thus avoiding residues and breakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the color-resist layer film thickness is increased for large curved screens, then the display quality is improved, but it becomes difficult to drill via-holes and color-resist residues occur
Solution Approach 1:
The signal lead-out wire extends along the sidewall of the insulating boss in a three-dimensional path rather than through a vertical via-hole. This dimensional change allows the wire to bypass the thick color-resist layer without requiring deep via-hole drilling, solving both the display quality requirement (thick color-resist layer) and the manufacturing difficulty (via-hole drilling).
Solution Approach 2:
The insulating boss serves as an intermediary structure that supports the signal lead-out wire along its sidewall. This mediator enables the wire to extend through or alongside the thick color-resist layer without direct via-hole penetration, eliminating color-resist residues while maintaining signal transmission.
2Manufacturing precision
If the color-resist layer film thickness is increased for large curved screens, then the display quality is improved, but wire breakage occurs during metal climbing
Solution Approach 1:
The signal lead-out wire follows a three-dimensional path along the insulating boss sidewall instead of a vertical path through the color-resist layer. This dimensional change distributes the wire length and reduces stress concentration, preventing wire breakage during metal climbing while maintaining the thick color-resist layer for display quality.
Solution Approach 2:
The insulating boss provides structural support and cushioning for the signal lead-out wire before the wire is subjected to stress during metal climbing. This prior protection prevents wire breakage by distributing mechanical stress along the wire's path.
3Reliability
If via-holes are drilled through the thick color-resist layer, then electrical connection is achieved, but color-resist residues remain in the via-holes
Solution Approach 1:
The insulating boss acts as an intermediary structure that carries the signal lead-out wire along its sidewall. This approach achieves electrical connection without requiring via-holes to penetrate the thick color-resist layer, thereby eliminating color-resist residues while maintaining reliable signal transmission.
Solution Approach 2:
Instead of achieving electrical connection through vertical via-holes, the signal lead-out wire extends along the sidewall of the insulating boss in a three-dimensional path. This dimensional change enables electrical connection without via-hole drilling, eliminating the residue problem.
4Reliability
If via-holes are drilled through the thick color-resist layer, then electrical connection is achieved, but the process yield decreases
Solution Approach 1:
The insulating boss serves as a mediator that enables electrical connection through the thick color-resist layer without requiring complex via-hole drilling processes. This simplifies the manufacturing process, improves process yield, and maintains reliable electrical connection for signal transmission.
Solution Approach 2:
The signal lead-out wire extends along the insulating boss sidewall in a three-dimensional path rather than through vertical via-holes. This dimensional approach simplifies the manufacturing process by eliminating difficult via-hole drilling through thick layers, thereby improving process yield while maintaining electrical connection.
Data Source
AI summary
Provided an array substrate, as well as a method for preparing an array substrate, a display panel, and a display device, includes: substrate; driver circuits located on side of the substrate; signal lead-out structure located on side of the driver circuits facing away from the substrate and including insulating boss and signal lead-out wires one of which electrically connected to an output electrode of a driver circuit, and at least part of the signal lead-out wire extends along sidewall of the insulating boss; a color-resist layer located on side of the driver circuits facing away from the substrate and surrounding sidewall of the signal lead-out structure, and thickness of the color-resist layer less than or equal to extension length of the signal lead-out wire; and a first electrode located on side of the signal lead-out structure facing away from the substrate and electrically connected to the signal lead-out wire.