Array Substrate Signal Line Overlap for Denser Light Field Pixels

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Solution Overview

Problem

Conventional light field display devices face challenges in reducing light-emitting point size and increasing density due to the large number of signal lines associated with each light-emitting point, which limits pixel resolution.

Innovation Solution

The proposed solution involves an array substrate with a substrate, electrodes, and first signal lines where at least two first signal lines are located in different layers of an insulating spacer, allowing their orthographic projections to overlap, thereby reducing the overall width and enabling smaller light-emitting points and higher density distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If each light-emitting point is associated with a large number of signal lines, then the light-emitting point can be properly driven, but the light-emitting point size cannot be reduced

Engineering Contradiction:
Improvesignal line connectionVSAvoidlight-emitting point size
Core Design Contradiction:
ReliabilityVSLength of moving object

Solution Approach 1:

The patent applies three-dimensional stacking of signal lines in different layers to reduce the planar footprint. Multiple signal lines are arranged vertically across different insulating spacer layers, allowing them to overlap when viewed from above. This transforms a two-dimensional routing problem into a three-dimensional structure, enabling more signal lines to pass through a smaller horizontal area, thus reducing light-emitting point size while maintaining proper connections.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent implements nesting by placing multiple signal lines within nested insulating spacer layers. Each signal line is embedded in its own insulating layer, with layers stacked one inside another vertically. This nested arrangement allows multiple signal lines to occupy the same horizontal space at different vertical levels, reducing the overall width required and enabling smaller light-emitting point dimensions.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Reliability

If each light-emitting point is associated with a large number of signal lines, then the driving function is maintained, but the density distribution of light-emitting points cannot be increased

Engineering Contradiction:
Improvedriving signal transmissionVSAvoiddensity of light-emitting points
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

By transitioning from two-dimensional to three-dimensional signal line arrangement across multiple insulating spacer layers, the patent reduces the horizontal space required per light-emitting point. This enables higher density distribution of light-emitting points on the substrate while maintaining all necessary driving signal connections through the stacked signal line configuration.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent merges multiple signal lines into a compact vertical stack within the insulating spacer structure. By combining multiple signal transmission paths into a single vertical column space, the horizontal area per light-emitting point is minimized, allowing increased density of light-emitting points while preserving all driving functions.

Inventive Principle:
Principle #5Merging (Combining)

3Area of stationary object

If signal lines are arranged in different layers with overlapping projections, then the overall width is reduced, but the manufacturing complexity increases

Engineering Contradiction:
Improveoverall widthVSAvoidsignal line fabrication
Core Design Contradiction:
Area of stationary objectVSEase of manufacture

Solution Approach 1:

The patent segments the signal line fabrication into discrete steps corresponding to different insulating spacer layers. Each signal line is formed in sequence within its designated layer, allowing independent fabrication and control. This segmentation simplifies the manufacturing process by breaking down the complex multi-layer structure into manageable, sequential fabrication steps rather than attempting to create all layers simultaneously.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS11804514B2Array substrate and light field display device with overlapping signal lines
Publication Date: 2023.10.31 BOE TECHNOLOGY GROUP CO LTD
  • US11804514B2 patent drawing
  • US11804514B2 patent drawing
  • US11804514B2 patent drawing

AI summary

An array substrate is provided, including a substrate, wherein the substrate is provided with a plurality of electrodes and a plurality of first signal lines, each of the electrodes being correspondingly connected with a first signal line. In some examples, the first signal lines extend in the same direction. In some examples, at least two of the plurality of first signal lines are located in different layers of an insulating spacer from each other. In some examples, orthographic projections on the substrate of at least two of the first signal lines in the different layers at least partially overlap. Accordingly, a light field display device comprising the array substrate is also provided. The array substrate can reduce a light-emitting point size and increase a density distribution of light-emitting points.