Array Substrate Single Patterning Process Reduces Lithography Steps
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Solution Overview
Problem
Conventional methods for manufacturing array substrates require 6 to 8 lithography masking processes, leading to lengthy research and development times, high production costs, and increased manufacturing complexity.
Innovation Solution
The array substrate is manufactured using a method that forms the active layer, first transparent electrode, and etch stop layer through a single patterning process and doping process, reducing the number of necessary patterning processes and simplifying the production workflow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional lithography masking processes are used to manufacture array substrate, then manufacturing precision can be achieved, but the number of processes increases and manufacturing cost increases
Solution Approach 1:
The patent merges multiple patterning processes into a single lithography masking process by forming the active layer, first transparent electrode, and etch stop layer simultaneously through one doping process, thereby reducing the total number of lithography masking processes from 6-8 to fewer steps while maintaining patterning precision
Solution Approach 2:
The patent creates multi-functional layers where the same material layer serves multiple purposes: the active layer also functions as the first transparent electrode and etch stop layer, allowing one lithography masking process to define multiple structural elements with different functions
2Manufacturing precision
If multiple lithography masking processes are used, then pattern definition accuracy is maintained, but research and development time increases
Solution Approach 1:
The patent combines multiple sequential patterning operations into a single lithography masking step, where one photoresist pattern defines the active layer, first transparent electrode, and etch stop layer regions simultaneously, drastically reducing the number of lithography masking cycles required during R&D iterations
3Manufacturing precision
If conventional multi-step patterning is used, then structural quality is ensured, but manufacturing cost increases
Solution Approach 1:
The patent consolidates multiple doping processes and lithography masking steps into a single integrated process step, reducing the number of expensive equipment uses, material consumables, and process control requirements while maintaining the structural quality of the formed layers
Solution Approach 2:
By designing the active layer to simultaneously serve as the first transparent electrode and etch stop layer, the patent eliminates the need for separate manufacturing processes for these components, reducing overall manufacturing cost while ensuring structural integrity
Data Source
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AI summary
An embodiment of the disclosure provides an array substrate comprising: a base substrate, an active layer and a transparent electrode disposed on the base substrate, an etch stop layer disposed on the active layer and configured for protecting a portion of the active layer, wherein the active layer, the transparent electrode and the etch stop layer are formed through one patterning process and one doping process, the doped region and the first transparent electrode are made of same material and are disposed on the same layer.