Array Substrate Six-Photolithography Process
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Solution Overview
Problem
The manufacturing process of array substrates for liquid crystal displays is complex, costly, and time-consuming, primarily due to the 12-channel photolithography process used.
Innovation Solution
A six-channel photolithography process is adopted, involving specific deposition and etching steps with different photoresist layers and masks, including buffer layers, source-drain metal layers, polysilicon layers, gate insulating layers, and common electrode layers, to simplify the production process and reduce costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a 12-channel photolithography process is used to manufacture array substrates, then the manufacturing precision and reliability are improved, but the device complexity, production cost, and production cycle increase significantly
Solution Approach 1:
The patent combines multiple photolithography channels into a unified process flow. Specifically, it integrates the formation of source/drain electrodes, conductive channels, gate electrodes, pixel electrodes, and touch electrodes into a coordinated six-channel photolithography system, reducing the traditional 12-channel complexity while maintaining manufacturing precision through optimized process sequencing and shared etching steps
Solution Approach 2:
The patent creates multi-functional photolithography masks and etching processes that serve multiple purposes. For example, the same etching process is used to form via holes in gate insulating layers and pattern metal layers, and photolithography masks are designed to define multiple electrode types and connection structures simultaneously, reducing the number of dedicated process steps
2Manufacturing precision
If a 12-channel photolithography process is used to manufacture array substrates, then the manufacturing precision is improved, but the production cost increases
Solution Approach 1:
The patent merges 12 separate photolithography channels into six integrated channels, directly reducing material consumption, equipment usage time, and process overhead costs. The consolidated process uses fewer photoresist layers, masks, and etching chemicals while achieving the same structural precision through optimized process design
Solution Approach 2:
The patent eliminates redundant process steps and materials from the traditional 12-channel approach. By identifying and removing duplicate or overlapping photolithography operations, the process reduces waste of photoresist, masks, and etching materials, thereby lowering production costs while maintaining necessary manufacturing precision
3Manufacturing precision
If a 12-channel photolithography process is used to manufacture array substrates, then the manufacturing precision is improved, but the production cycle becomes longer
Solution Approach 1:
The patent combines 12 sequential photolithography operations into six integrated steps, halving the number of deposition, exposure, development, and etching cycles. This consolidation maintains precision through coordinated process timing and shared critical steps while significantly reducing the total production cycle time
Solution Approach 2:
The patent performs preliminary process planning and mask design to enable multi-functional operations. By pre-configuring photolithography masks to define multiple electrode patterns and connection structures in single exposure steps, and by sequencing process steps to allow parallel operations where possible, the system achieves high precision without the time penalty of sequential 12-channel processing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the production process, reduces production costs, and shortens the production cycle while maintaining the touch function in array substrates.
Implementation Method 1
depositing a buffer layer, a source-drain metal layer, and a first photoresist layer on a substrate in sequence
Implementation Method 2
depositing an amorphous silicon layer, and performing laser annealing on the amorphous silicon layer to form the polysilicon layer
Data Source
AI summary
An array substrate and a manufacturing method thereof in the embodiment of the present invention can complete the process of the array substrate with the touch function by using six photolithography processes, thereby simplifying the production process, saving cost, and shortening the production cycle.


