Array Substrate Fabrication via Stamp Printing
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Solution Overview
Problem
The high fabrication expenses and complexity of the mask process in producing array substrates for liquid crystal display (LCD) devices, which require multiple physical and chemical steps and expensive apparatus, hinder efficient production.
Innovation Solution
The method employs an in-plane printing process using a stamp with convex portions to form holes in insulating layers, eliminating the need for a mask process by directly contacting and patterning organic or inorganic insulating materials, thereby reducing production costs and simplifying the fabrication process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a mask process is used to form patterns on the array substrate, then manufacturing precision can be achieved, but fabrication expenses and process complexity increase significantly
Solution Approach 1:
The patent extracts and eliminates the mask process from the fabrication sequence by using a stamp-based in-plane printing method. The stamp directly contacts the insulating layer to form contact holes without requiring separate mask layers, exposing, developing, and etching steps, thereby reducing process complexity while maintaining pattern formation precision.
Solution Approach 2:
The patent replaces the optical-mechanical mask system with a direct mechanical stamping system. The stamp with convex portions physically contacts and presses the insulating layer to form contact holes, substituting the complex optical alignment and chemical development processes with a simpler mechanical deformation approach.
2Manufacturing precision
If a mask process is used to form patterns on the array substrate, then manufacturing precision can be achieved, but production time and costs increase
Solution Approach 1:
The patent merges multiple sequential mask process steps (mask deposition, exposure, development, etching, mask removal) into a single stamping operation. The stamp directly forms contact holes in the insulating layer in one step, eliminating the need for separate processing steps and significantly reducing fabrication time while maintaining precision.
Solution Approach 2:
The stamp is pre-formed with convex portions that define the contact hole patterns before the actual fabrication process. This preliminary preparation of the stamp structure allows direct pattern transfer to the insulating layer without requiring real-time mask alignment and exposure procedures, thereby reducing fabrication time.
3Manufacturing precision
If multiple photolithographic processes are used to form patterns, then manufacturing precision is maintained, but ease of manufacture deteriorates due to expensive apparatus and complex procedures
Solution Approach 1:
The patent employs a stamp that can be replaced or reused multiple times to form patterns. The stamp serves as a disposable or limited-life tool that eliminates the need for expensive, complex photolithography apparatus. The simple mechanical stamping process is easier to manufacture and implement compared to multiple photolithographic processes requiring specialized equipment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces production costs and time by eliminating the mask process, improving productivity and simplifying the fabrication of array substrates for LCD devices.
Implementation Method 1
The organic insulating material layer has photo curability, flexibility and dynamic stability
Data Source
AI summary
A method of fabricating an array substrate for a liquid crystal display device comprises forming a gate line, a data line that crosses the gate line and a thin film transistor connected to the gate line and the data line on a substrate, and forming an organic insulating material layer on the gate line, the data line and the thin film transistor. The organic insulating material layer has photo curability, flexibility and dynamic stability. The method further comprises forming a passivation layer that has a drain contact hole from the organic insulating material layer by using a stamp that has a convex portion. The drain contact hole exposes a drain electrode of the thin film transistor. The method also comprises forming a pixel electrode on the passivation layer. The pixel electrode is connected to the drain electrode through the drain contact hole.