Array Substrate With Stepped Photoresist Reducing Patterning Steps
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Solution Overview
Problem
The existing manufacturing processes for LTPS TFT array substrates are lengthy, resulting in low process yield and high manufacturing costs due to the requirement of multiple patterning processes, which complicates the production and increases the time needed for producing high-brightness and high-image-quality OLED panels.
Innovation Solution
A method for manufacturing an array substrate with a simplified structure, where the source and drain electrodes are formed in the same layer directly at the ends of the active layer, and the conductive electrode is disposed on the drain electrode, reducing the number of patterning processes to four, thereby simplifying the layer structure and manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple patterning processes are used to form source and drain electrodes separately, then the TFT structure can be precisely controlled, but the process time increases and manufacturing cost increases
Solution Approach 1:
The source electrode and drain electrode are formed in the same metal layer using a single patterning process, merging two separate formation steps into one. This reduces the total number of patterning processes from multiple to four, significantly shortening process time while maintaining precise TFT structure control through direct contact configuration
Solution Approach 2:
The metal layer serves multiple functions: it forms both the source electrode and drain electrode simultaneously, and the direct contact configuration also serves as the contact structure to the active layer, eliminating the need for separate contact holes and additional patterning steps
2Manufacturing precision
If multiple patterning processes are used to form source and drain electrodes separately, then the electrode positioning can be accurately controlled, but the manufacturing cost increases
Solution Approach 1:
The source and drain electrodes are formed together in one patterning step within the same metal layer, combining two separate manufacturing operations into one. This reduces material consumption, equipment usage, and labor costs while maintaining accurate electrode positioning through the direct contact configuration
Solution Approach 2:
The invention extracts and eliminates unnecessary intermediate structures such as separate contact holes and intermediate electrode layers, keeping only the essential source and drain electrodes in direct contact with the active layer, thereby simplifying the manufacturing process and reducing costs
3Manufacturing precision
If complex etching processes are used to form separate source and drain electrodes, then the electrode structure can be precisely formed, but the process complexity increases
Solution Approach 1:
The source and drain electrodes are formed as a single integrated structure in one patterning process, merging multiple complex etching steps into one simpler process. The direct contact configuration eliminates the need for complex contact hole etching through multiple insulating layers, reducing process complexity while maintaining precise electrode structure formation
Solution Approach 2:
Instead of forming electrodes through complex bottom-up approaches with multiple contact holes, the invention uses a top-down approach where the source and drain electrodes directly contact the active layer from above, inverting the traditional sequence and simplifying the overall process
Data Source
AI summary
An array substrate, a manufacturing method thereof and a display apparatus are provided. The array substrate includes thin-film transistors (TFTs) and conductive electrodes; the TFT includes a gate electrode, a source electrode, a drain electrode and an active layer; the source electrode and the drain electrode are arranged in the same layer and at two ends of the active layer and at least directly partially contact the upper surface or the lower surface of the active layer; and the conductive electrode is directly disposed on the electrode. With improved layer structures of the array substrate, a plurality of layer structures is formed in one patterning process by stepped photoresist process, so as to reduce the frequency of patterning processes, better ensure the compactness of the array substrate, and guarantee good contact between the layer structures in the array substrate.