Array Substrate Support Structure for Bonding Pad Alignment
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Solution Overview
Problem
Flexible electronic products face deformation issues due to stress from differing thermal expansion coefficients of components, leading to misalignment and bonding problems during the manufacturing process of flexible electronic devices.
Innovation Solution
An array substrate with a support structure is introduced, featuring bonding pads and support structures with a horizontal distance between them ranging from 5 μm to 1000 μm, which reduces deformation and maintains bonding pad alignment, enhancing product yield rates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If flexible substrate and electronic device are formed on rigid carrier and then removed, then flexible electronic product can be manufactured, but stress residue causes deformation and misalignment of bonding pads
Solution Approach 1:
The support structure is formed in advance during the manufacturing process on the bonding area of the array substrate. This preliminary structural reinforcement prevents deformation from occurring during subsequent steps such as removing the flexible substrate from the rigid carrier, thereby maintaining bonding pad alignment precision while enabling flexible product manufacturing
2Adaptability or versatility
If components with different thermal expansion coefficients are assembled together, then electronic device can be manufactured, but stress residue causes deformation after removal from rigid carrier
Solution Approach 1:
The support structure acts as an intermediary element between the bonding pads and the surrounding flexible substrate. It mediates the stress distribution caused by thermal expansion differences among components, providing a stable reference framework that maintains the relative positions of bonding pads while allowing the flexible substrate to accommodate thermal stresses
Data Source
AI summary
An array substrate includes a device array, a bonding pad, and at least one support structure. The bonding pad is located in a bonding area and is electrically connected to the device array. A horizontal distance between the at least one support structure and the bonding pad is between 5 μm and 1000 μm.