Array Substrate Test Signal Line Protection
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Solution Overview
Problem
During the fabrication of array substrates, the exposed testing signal line is prone to erosion and electrostatic damage due to lack of protection, affecting the display performance.
Innovation Solution
The array substrate design includes a test signal line with a first portion that surrounds the display area and a second portion with an end along the edge of the bonding area, which is covered by a bonding connector, preventing exposure and damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the test signal line is extended to the edge of the array substrate for testing purposes, then the testing function is enabled, but the exposed terminal becomes vulnerable to erosion and electrostatic damage
Solution Approach 1:
The bonding connector serves as an intermediary component that covers and protects the second terminal of the test signal line. It acts as a mediator between the exposed terminal and the harmful external environment, providing both physical protection against erosion and electrical protection against electrostatic damage while still allowing the testing function to operate
Solution Approach 2:
The bonding connector functions as a protective shell that envelops the exposed terminal of the test signal line. This shell structure provides a barrier against environmental erosion and electrostatic discharge, similar to how flexible shells and thin films protect underlying structures while allowing necessary functionality
2Reliability
If the test signal line is completely enclosed within the array substrate, then protection is improved, but the testing pad connection capability is lost
Solution Approach 1:
The test signal line is divided into two distinct portions: the first portion remains completely inside the array substrate for protection, while the second portion extends to the edge for testing connections. This segmentation allows each portion to fulfill its specific function - protection and connection respectively
Solution Approach 2:
The solution moves the exposed terminal from a completely external position to a partially internal position by having the second terminal extend along the edge rather than fully exposing it. This dimensional adjustment allows the terminal to maintain connection capability while being partially protected by the substrate structure
Data Source
AI summary
An array substrate having a display area, a peripheral area, and a bonding area inside the peripheral area is provided. The array substrate includes a bonding pad in the bonding area, the bonding pad configured to be connected to a peripheral circuit through a bonding connector, a test signal line including a first portion and a second portion. The first portion is in the peripheral area and substantially surrounds the display area. The first portion is electrically connected to the bonding pad. The first portion is completely inside the array substrate and has no exposed terminal. The second portion is in the bonding area. A first terminal of the second portion is electrically connected to the bonding pad. A second terminal of the second portion has an end along an edge of the array substrate in the bonding area.