Array Substrate With Through Hole Contact For Signal Shielding
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Solution Overview
Problem
The manufacturing process of photoelectric sensors with array substrates is complex and costly due to the need for multiple layers and process steps, which affects the performance of thin-film transistors (TFTs) by introducing signal interference and light leakage.
Innovation Solution
The first metal layer and passivation layer are patterned in the same process, merging production steps and reducing costs, while a through hole structure allows direct contact between the second metal layer and the source electrode, enhancing conductivity and shielding electrical fields.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a signal shielding metal layer is additionally arranged on the TFTs to shield induction current, then the signal-to-noise ratio is improved, but the device complexity and production cost increase due to numerous layers and process steps
Solution Approach 1:
The patent merges the signal shielding function with the pixel electrode structure by integrating the shielding metal layer into the existing electrode design. This allows the shielding function to be achieved without adding separate dedicated shielding layers, thereby reducing overall device complexity while maintaining signal-to-noise ratio performance
Solution Approach 2:
The patent designs the pixel electrode to simultaneously serve multiple functions: as the primary sensing electrode for detecting touch input and as a signal shielding structure to block induction current. This multi-functional design eliminates the need for separate shielding components, reducing the number of layers and process steps while improving reliability
2Object-affected harmful factors
If multiple layers are added to shield electrical fields, then the shielding effectiveness is improved, but the manufacturing complexity and production cost increase
Solution Approach 1:
The patent combines the shielding function with existing structural elements by integrating the shielding metal layer into the pixel electrode pattern. This merging approach achieves electrical field shielding without requiring additional separate shielding layers, thereby simplifying the manufacturing process while maintaining shielding effectiveness
Solution Approach 2:
The patent segments the shielding function into specific localized regions within the pixel electrode structure rather than requiring comprehensive shielding across the entire display. This segmented approach provides targeted shielding where most needed while reducing overall manufacturing complexity and material usage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces production costs, and improves the performance of TFTs by merging patterning processes and ensuring effective shielding of electrical fields and light interference.
Implementation Method 1
The photodiodes receive light and convert optical signals into electrical signals via photovoltaic effect
Data Source
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AI summary
Disclosed are an array substrate, a manufacturing method thereof, a sensor and a detection device. The array substrate includes: a base substrate (101); a thin-film transistor (TFT) (102) being disposed on the base substrate (101) and including a source electrode (1025) and an active layer (1023); a passivation layer (104) disposed on the TFT (102); a first metal layer (105) disposed on the passivation layer (104); an insulating layer (106) disposed on the first metal layer (105); a through hole structure (107) running through the insulating layer (106), the first metal layer (105) and the passivation layer (104); and a detection unit (103) being disposed on the insulating layer (106) and including a second metal layer (1031), wherein the second metal layer (1031) makes direct contact with the source electrode (1025) via the through hole structure (107). In the manufacturing process of the array substrate, a first metal layer and a passivation layer may be patterned in the same patterning process, so the production processes are merged and production is convenient, and meanwhile, the production cost is saved.