Array Substrate Through-Hole Cooling for Inorganic LED Displays
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Solution Overview
Problem
Inorganic electroluminescent displays with inorganic LEDs face a decrease in luminous efficiency and display characteristics due to increased temperature, leading to potential deterioration in performance.
Innovation Solution
A display device with a substrate having a through hole connecting its surfaces, where cathode wiring is electrically coupled to inorganic light-emitting elements and a heat radiator is positioned on the opposite surface, allowing efficient heat dissipation via heat transmitters to prevent temperature rise and maintain light-emission stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If inorganic LEDs are used as display elements, then light use efficiency is improved and environmental resistance is enhanced, but luminous efficiency decreases with temperature rise leading to deterioration of display characteristics
Solution Approach 1:
The patent introduces a through-hole structure that extends in the thickness direction (third direction) of the substrate, creating a three-dimensional heat dissipation pathway. This dimensional approach allows heat to be conducted from the cathode wiring through the substrate thickness to heat radiators on the rear surface, effectively resolving the temperature-related reliability issue while preserving the high light use efficiency of inorganic LEDs
2Temperature
If heat dissipation structures are added to maintain display characteristics at elevated temperatures, then temperature control is improved, but device complexity increases
Solution Approach 1:
The substrate serves multiple functions: it provides mechanical support for the display elements and simultaneously acts as a heat conduction path through its thickness. The through-hole structure integrates heat dissipation functionality into the existing substrate without requiring separate complex cooling systems, thereby controlling temperature while minimizing additional structural complexity
Solution Approach 2:
The substrate itself provides the heat conduction function through its inherent thermal properties and the introduced through-hole structure. The cathode wiring, anode wiring, and substrate materials all contribute to heat dissipation without requiring external active cooling mechanisms, allowing the device to self-regulate temperature through passive heat conduction to rear-surface radiators
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents the reduction in light-emission output and ensures stable operation of inorganic light-emitting elements by efficiently radiating heat, thereby maintaining display characteristics and performance even at elevated temperatures.
Implementation Method 1
a heat radiator provided on the second surface of the substrate
Implementation Method 2
The substrate has a through hole that connects the first surface with the second surface in the peripheral region of the substrate and overlaps the cathode wiring in planar view
Data Source
AI summary
A display device comprising: a substrate having a first surface and a second surface opposite to the first surface; a plurality of pixels arrayed in a display region of the substrate; an inorganic light-emitting element provided to each of the pixels on the first surface of the substrate; cathode wiring provided in a peripheral region between the display region and an end of the substrate on the first surface of the substrate and electrically coupled to the inorganic light-emitting element; and a heat radiator provided on the second surface of the substrate, wherein the substrate has a through hole that connects the first surface with the second surface in the peripheral region of the substrate and overlaps the cathode wiring in planar view viewed from a direction perpendicular to the first surface of the substrate.