Array Substrate Double-Sided Conductive Routing via Through-Holes
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Solution Overview
Problem
Existing display apparatuses face challenges in reducing border areas to improve visual effect and resolution without increasing size, as current designs struggle to efficiently utilize space for more pixels.
Innovation Solution
The array substrate features a substrate with through holes and insulating and conductive layers, where the openings in these layers are wider than the holes, allowing conductive structures to extend through and cover opposite sides, forming a double-sided conductive routing structure that reduces the border area and enhances resolution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the border area of the display apparatus is reduced to improve visual effect and resolution, then the view field size or pixel density is improved, but the space for conductive routing becomes insufficient
Solution Approach 1:
The conductive structure extends in the vertical dimension by passing through the substrate via through-holes, transitioning from a planar routing approach to a three-dimensional configuration. This allows conductive routing to occur both on the surface and through the substrate, effectively utilizing the Z-axis dimension to resolve the space constraint caused by reduced border areas.
Solution Approach 2:
The conductive structure is nested within the substrate by forming through-holes that penetrate the substrate thickness. The conductive material is deposited within these through-holes, creating a nested configuration where the conductive routing is embedded inside the substrate volume rather than occupying only the surface plane.
2Ease of manufacture
If the opening width in insulating layers is increased to facilitate conductive structure formation, then the ease of manufacture is improved, but the spacing between conductive elements is reduced
Solution Approach 1:
The conductive routing is segmented into multiple parts: conductive patterns on the first surface, through-holes penetrating the substrate, and conductive structures within the through-holes. This segmentation allows different portions to be optimized independently - the openings can be sufficiently wide for easy conductive structure formation while the overall spacing is controlled by the substrate dimensions and through-hole positioning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the border region of the display apparatus, allowing for a larger view field or improved resolution by enabling more efficient use of space for pixels, while protecting the insulating layers during laser drilling and facilitating conductive structure formation.
Implementation Method 1
protecting the insulating layers during laser drilling
Data Source
AI summary
An array substrate includes a substrate as well as a first insulating layer, a first conductive layer, a second insulating layer, a second conductive layer and a conductive structure sequentially formed thereon. The first insulating layer has a first opening communicated with a through hole of the substrate. The first conductive layer includes a first ring pattern extending from top of the first insulating layer into the first opening. The second insulating layer has a second opening communicated with the first opening. The second conductive layer includes a second ring pattern extending from top of the second insulating layer into the second opening. The first ring pattern laterally protrudes toward an axis of the through hole from the second ring pattern. The conductive structure extends from above the second insulating layer to a bottom surface of the substrate through the first and second openings and the through hole.