Array Substrate Two-Stage Through-Hole Connection for Flexible Displays
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Solution Overview
Problem
Flexible display panels face a technical issue of poor connection between the source/drain and the active layer due to the presence of an organic flexible material layer, which increases the difference in film layers and depth of through-holes, leading to disconnection and display screen abnormalities.
Innovation Solution
The array substrate design includes a substrate with an active layer, a first metal layer forming a gate, a second metal layer forming a connection member, and a flexible material layer forming a source/drain layer, where the source or drain is connected to the first connection member by a first through-hole and the connection member is connected to the doped region by a second through-hole, with the aperture of the first through-hole being greater than the second, allowing a two-stage connection that reduces the depth of each through-hole and improves connection yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If an organic flexible material layer is formed on the interlayer insulating layer to improve bending performance, then the flexibility of the display panel is improved, but the depth of through-holes increases and connection between source/drain and active layer deteriorates
Solution Approach 1:
The patent divides the connection path into two separate through-holes: a first through-hole extending from the source/drain electrode to the second metal layer, and a second through-hole extending from the second metal layer to the active layer. This segmentation reduces the depth of each individual through-hole, improving filling reliability while maintaining the flexible material layer for bending performance.
Solution Approach 2:
The second metal layer serves as an intermediary connection layer between the source/drain electrode and the active layer. It provides a transition interface that enables reliable electrical connection through two shallower through-holes, resolving the connection problem caused by the deep single through-hole required in conventional structures with flexible material layers.
2Reliability
If the aperture of the first through-hole is increased to improve filling reliability, then the connection yield is improved, but the amount of material required increases
Solution Approach 1:
By segmenting the connection into two through-holes, the patent allows the first through-hole to have a larger aperture for reliable filling, while the second through-hole can have a smaller aperture since it connects to the doped region. This segmentation enables optimized material usage for each through-hole based on its specific functional requirements.
Data Source
AI summary
The present application provides an array substrate and a display panel. The array substrate includes a substrate, an active layer, a first metal layer, a second metal layer, a flexible material layer, and a source/drain layer which are disposed in a stack. The active layer forms a source and a drain and connected to a first connection member formed by the second metal layer through a first through-hole. The first connection member is connected to a doped region of the active layer by a second through-hole. An aperture of the first through-hole is greater than an aperture of the second through-hole. Therefore, a technical problem of a poor connection between the source/drain and the active layer is relieved.