Array Substrate Via Manufacturing with Segmented Color Resist Layers
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Solution Overview
Problem
Liquid crystal display panels face challenges in widening their color gamut and maintaining display quality due to the difficulty in manufacturing vias through thick color resist layers, which can lead to light leakage and poor contact between pixel electrodes and TFTs, especially when the panels are bent into curved shapes.
Innovation Solution
The array substrate design includes at least two color resist layers with a medium layer in between, allowing for separate via manufacturing in each layer, reducing the risk of damage and residue, and enhancing the display effect by maintaining accurate alignment and contact between electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single thick color resist layer is used to widen the color gamut, then the display effect is improved, but the via manufacturing difficulty increases and contact reliability deteriorates
Solution Approach 1:
The single thick color resist layer is divided into multiple thinner color resist layers. This segmentation allows vias to be manufactured through each layer separately with smaller opening sizes, improving manufacturing precision and contact reliability while maintaining the total thickness needed for color gamut performance.
Solution Approach 2:
The solution transitions from a single-layer structure to a multi-layer structure in the vertical dimension. By stacking multiple color resist layers, the patent achieves both via manufacturability (through smaller openings in each layer) and color gamut (through cumulative thickness).
2Reliability
If a single thick color resist layer is used, then the color gamut is widened, but light leakage occurs due to manufacturing defects
Solution Approach 1:
Dividing the thick color resist layer into multiple thinner layers reduces manufacturing defects in each layer, thereby preventing light leakage while maintaining the overall color gamut performance through the cumulative effect of all layers.
3Adaptability or versatility
If the display panel is bent into a curved shape to enlarge viewing angle, then the viewing angle is improved, but the alignment precision between vias and electrodes deteriorates
Solution Approach 1:
By manufacturing vias through multiple thinner layers separately, the patent achieves better alignment precision in each layer. This segmented approach compensates for the misalignment issues that occur when the display panel is bent into a curved shape, maintaining electrode contact reliability despite the curvature-induced deformation.
4Manufacturing precision
If at least two color resist layers are used with separate via manufacturing, then the via manufacturing precision is improved, but the device structure becomes more complex
Solution Approach 1:
The patent segments the via manufacturing process into multiple steps corresponding to each color resist layer. This segmentation improves via manufacturing precision by using smaller opening sizes in each layer, while the increased structural complexity is acceptable given the significant improvement in contact reliability and display performance.
Data Source
AI summary
Provided are an array substrate, a display panel, and a display device. The array substrate includes a base substrate, a thin-film transistor disposed on one side of the base substrate, a pixel electrode, and at least two color resist layers disposed between the TFT and the pixel electrode. A medium layer is disposed between any two adjacent color resist layers. The pixel electrode is electrically connected to a first electrode of the thin-film transistor through a via.