Array Substrate Insulating Layer Layout for Signal Wire Continuity
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Solution Overview
Problem
Conventional display panel manufacturing techniques result in low yield due to signal wires being prone to disconnection near openings in the display area and non-display area, leading to inefficiencies in signal transmission.
Innovation Solution
An array substrate with an insulating layer having a first area and a second area, where the first area is thinner than the second area, is used to prevent photoresist flow into openings, ensuring sufficient coverage of conductive material and reducing the likelihood of over-etching during the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If openings are provided in the insulating layer for signal wire connection, then signal transmission between layers is enabled, but photoresist flows into the openings causing conductive material disconnection
Solution Approach 1:
The insulating layer is designed with different thicknesses in different regions: a first thickness in the first area surrounding the opening and a second thickness in the second area, where the first thickness is less than the second thickness. This local quality variation prevents photoresist from flowing into the opening while ensuring sufficient coverage in other areas, thereby resolving the contradiction between enabling signal transmission and preventing manufacturing defects.
2Ease of manufacture
If uniform thickness insulating layer is used, then manufacturing process is simple, but photoresist flows into openings causing wire disconnection
Solution Approach 1:
The insulating layer transitions from uniform thickness to non-uniform thickness with a first area having reduced thickness around the opening. This localized modification maintains manufacturing simplicity while significantly improving conductive part connection reliability by preventing photoresist infiltration into the opening during the patterning process.
3Manufacturing precision
If photoresist coverage is reduced near openings, then etching precision improves, but conductive material becomes disconnected
Solution Approach 1:
The insulating layer thickness is locally reduced in the first area surrounding the opening, which allows for better etching control and precision in that specific region. Meanwhile, the thicker second area maintains sufficient photoresist coverage to prevent conductive material disconnection, thus resolving the contradiction between etching precision and material continuity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves the yield of conductive parts by maintaining sufficient photoresist coverage and slowing down the flow of photoresist, thereby reducing disconnections and enhancing the overall reliability of the display panel.
Implementation Method 1
the insulating layer is provided with an opening... a thickness of the first area is less than a thickness of the second area, and the first area is arranged around at least a part of the opening
Data Source
AI summary
An array substrate, a method for manufacturing an array substrate, a display panel and a display device are provided. The array substrate includes a substrate; an insulating layer arranged at a side of the substrate, where the insulating layer is provided with an opening, the insulating layer includes a first area and a second area, a thickness of the first area is less than a thickness of the second area, and the first area is arranged around at least a part of the opening; and a first conductive part arranged at a side of the insulating layer away from the substrate, where an orthographic projection of the first conductive part on the substrate and an orthographic projection of the first area on the substrate are at least partially overlapped.