Array Substrate Lead-Out Wire Corrosion Resistance
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Solution Overview
Problem
Display devices face challenges in maintaining signal integrity due to corrosion of lead-out wires, which can be exacerbated by the presence of solid impurities, oxygen, and water, especially when the lead-out wires have consistent thickness and inclining angles on both sides of the sealant, leading to defects in electric signal transmission and hindering a light and thin design.
Innovation Solution
The array substrate design features varying lead-out wire configurations, including wider third leads with a greater area ratio than first leads, different inclining angles, and corrosion-resistant layers, to reduce corrosion and optimize signal transmission while minimizing layout space, thereby supporting a light and thin product design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the line width of the lead-out wires is increased to reduce corrosion, then the corrosion resistance is improved, but the size of the display device increases
Solution Approach 1:
The patent applies different line widths to lead-out wires in different regions: wires in the third region (outside sealant, high corrosion risk) have larger line widths for corrosion resistance, while wires in the first region (inside sealant, low corrosion risk) have smaller line widths to minimize device size. This local differentiation resolves the contradiction between corrosion resistance and compact size.
Solution Approach 2:
The lead-out wire structure is segmented into multiple regions (first region inside sealant, second region on sealant, third region outside sealant) with different design characteristics. Each segment is optimized independently: the third region uses wider wires for corrosion protection, while the first region uses narrower wires for size reduction, allowing simultaneous achievement of both corrosion resistance and compact dimensions.
2Area of stationary object
If the spacing between adjacent lead-out wires is decreased to reduce device size, then the compactness is improved, but the corrosion resistance deteriorates due to solid impurities in narrow wires
Solution Approach 1:
The patent implements different spacing and line width characteristics in different regions: the third region outside the sealant uses larger line widths and appropriate spacing to ensure corrosion resistance, while the first region inside the sealant uses smaller dimensions to achieve compactness. This local quality differentiation allows the device to be compact overall while maintaining corrosion resistance where it is most needed.
3Area of stationary object
If the inclining angle of the lead-out wires is optimized for compact layout, then the device size is reduced, but the signal transmission reliability may be affected
Solution Approach 1:
The patent optimizes the inclining angles of lead-out wires differently in different regions: wires in the third region outside the sealant use angles optimized for corrosion resistance and signal reliability, while wires in the first region use angles optimized for compact layout. This regional optimization allows compact overall design while maintaining signal transmission reliability in the critical external region.
Data Source
AI summary
An array substrate and a display device are provided. The array substrate includes: a base substrate; and first leads, third leads, and second leads connecting the first leads and the third leads on the base substrate. The base substrate includes a second region corresponding to a sealing material, a sealed first region, and a third region provided on a side of the second region away from the first region. The first region includes the first leads; the second region includes the second leads; and the third region includes the third leads. The area ratio of two adjacent third leads is greater than that of corresponding two adjacent first leads.