Array Substrate Conducting Wires Prevent Static Discharge

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Solution Overview

Problem

In array substrate assemblies, the overlapping orthogonal projections of wirings on a substrate lead to static electricity accumulation and electrostatic discharge due to long wirings, despite the presence of insulating layers.

Innovation Solution

The array substrate assembly features conducting wires with discontinuous segments and connection parts that electrically connect adjacent segments, along with via holes to facilitate electrical connections, preventing static electricity accumulation and discharge by ensuring that the orthogonal projections of the wires do not overlap continuously.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If long wirings are used in array substrate assembly, then electrical connectivity is achieved, but static electricity accumulation and electrostatic discharge occur

Engineering Contradiction:
Improveelectrical connectivityVSAvoidstatic electricity accumulation
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent divides long conducting wires into multiple discontinuous conducting segments. Each segment is electrically isolated from adjacent segments by insulating layers, preventing continuous static electricity accumulation along the wire length. The segments are selectively connected through via holes to maintain necessary electrical connectivity while breaking the continuous path that causes ESD

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Insulating layers are introduced as intermediary materials between adjacent conducting segments and between overlapping wirings. These insulating layers act as mediators that prevent direct electrical contact and static charge transfer, thereby eliminating the ESD pathway while allowing the wiring structure to maintain its functional connectivity through controlled via connections

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If insulating layers are formed between wirings, then electrical isolation is achieved, but static electricity still accumulates on long wirings

Engineering Contradiction:
Improveelectrical isolationVSAvoidstatic electricity accumulation
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The conducting wires are segmented into multiple discrete sections separated by insulating layers. This segmentation prevents the formation of long continuous conducting paths that would otherwise accumulate static electricity, even though insulating layers are present between overlapping regions

Inventive Principle:
Principle #1Segmentation

3Object-affected harmful factors

If conducting wires are made discontinuous to prevent static electricity, then electrostatic discharge is reduced, but electrical connectivity may be compromised

Engineering Contradiction:
Improveelectrostatic dischargeVSAvoidelectrical connectivity
Core Design Contradiction:
Object-affected harmful factorsVSReliability

Solution Approach 1:

The conducting wires are divided into segments that are discontinuous in the planar wiring layers, which prevents static electricity accumulation. However, selective via holes are created to establish electrical connections between specific segments when needed, thereby maintaining functional connectivity while preserving the ESD protection benefits of discontinuity

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions the electrical connection from a two-dimensional planar wiring structure to a three-dimensional structure by introducing via holes that penetrate through insulating layers. This dimensional change allows segments to be electrically connected in the vertical dimension while remaining discontinuous in the horizontal plane, simultaneously achieving both ESD protection and electrical connectivity

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS10593706B2Array substrate assembly, method of manufacturing array substrate assembly, display panel and display apparatus
Publication Date: 2020.03.17 BOE TECHNOLOGY GROUP CO LTD
  • US10593706B2 patent drawing
  • US10593706B2 patent drawing
  • US10593706B2 patent drawing

AI summary

The present disclosure relates to an array substrate assembly, a method of manufacturing the array substrate assembly, a display panel and a display apparatus. An array substrate assembly includes: a substrate; a first conducting wire on the substrate; a first insulating layer on the first conducting wire; a second conducting wire on the first insulating layer, wherein orthogonal projections of the first conducting wire and the second conducting wire on the substrate at least partly overlap, and at least one of the first conducting wire and the second conducting wire is constituted by a plurality of conducting segments arranged discontinuously; and a connection part configured to electrically connect adjacent ones of the conducting segments of the first conducting wire or the second conducting wire.