Array Substrate Wiring Layout for Uniform Display Density
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Solution Overview
Problem
In display technologies with punched screens or under-screen cameras, signal lines around holes or transparent regions cannot pass through, leading to uneven wiring density, resulting in significant optical differences and display quality issues between main and secondary screens.
Innovation Solution
An array substrate with a first metal wiring layer positioned away from the substrate and overlapping orthographic projections of other metal wiring layers, which compensates for wiring density, ensuring uniformity and reducing display differences by blocking metal wirings from the display side.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If signal lines are wound around the hole region or transparent display region to connect different regions, then the signal lines can be connected, but the wiring density becomes uneven and optical differences occur between main screen and secondary screen display regions
Solution Approach 1:
The patent introduces multiple metal wiring layers stacked in the vertical dimension to resolve the wiring density imbalance. By distributing signal lines across different layers (first metal wiring layer, second metal wiring layer, etc.), the patent achieves uniform overall wiring density while maintaining necessary connections around hole regions and transparent display regions.
Solution Approach 2:
The patent segments the wiring system into multiple independent metal wiring layers, each carrying specific signal lines. This segmentation allows different regions (main screen, secondary screen, hole regions, transparent display regions) to have optimized wiring arrangements in different layers, resolving the contradiction between connection reliability and density uniformity.
2Ease of manufacture
If multiple metal wiring layers are stacked with orthographic projections overlapping, then wiring density can be compensated and uniformed, but the device structure becomes more complex
Solution Approach 1:
The patent merges multiple metal wiring layers into a unified wiring system where layers are stacked and electrically connected through conductive structures. By combining the functionality of multiple layers into a single integrated wiring system, the patent achieves wiring density compensation while managing structural complexity through systematic design.
Solution Approach 2:
Each metal wiring layer serves multiple functions: carrying signal lines, compensating wiring density, and contributing to overall display uniformity. The first metal wiring layer, for example, contains signal lines that wind around hole regions while also providing density compensation when stacked with other layers, achieving multi-functionality that resolves the contradiction.
Data Source
AI summary
An array substrate, a display panel and a display apparatus. The array substrate includes a first region and a second region surrounding at least a part of the first region, and the array substrate includes a substrate and a plurality of metal wiring layers formed on the substrate, in which the plurality of metal wiring layers include a first metal wiring layer positioned on a side of any of other metal wiring layers away from the substrate; and orthographic projections of at least a part of the other metal wiring layers on the substrate are positioned within an orthographic projection of the first metal wiring layer on the substrate, and the first metal wiring layer is configured to compensate for a density of metal wirings.