Array Substrate Wiring Layout Without Inorganic Protection
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Solution Overview
Problem
The high manufacturing cost of mini LED backlights for LCD displays limits their development and adoption in the display field.
Innovation Solution
A manufacturing method for an array substrate that simplifies processing by forming wirings and pads on the same layer without the need for separate conductive layers, and omits the step of forming an inorganic protective layer, thereby reducing production time and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional multi-layer wiring and pad formation processes are used, then reliability and protection are improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent combines the formation of wirings and pads into a single layer structure, eliminating the need for separate conductive layers. This merging of functions reduces the number of processing steps while maintaining the electrical connectivity and protection requirements, directly addressing the contradiction between reliability and manufacturing complexity
Solution Approach 2:
The single layer structure serves multiple functions simultaneously - it provides both wiring connections and pad structures, and also offers protective coverage. This multi-functionality approach allows the same structural element to fulfill multiple roles that traditionally required separate layers, reducing overall device complexity while maintaining reliability
2Reliability
If inorganic protective layer formation and patterning steps are included, then protection is improved, but production time increases
Solution Approach 1:
The patent extracts and removes the inorganic protective layer formation and patterning steps from the manufacturing process. By eliminating these time-consuming steps while maintaining protection through alternative means (the integrated layer structure), the invention directly resolves the contradiction between protection quality and production efficiency
Solution Approach 2:
The invention employs a removable protective layer that can be easily applied and removed without requiring permanent inorganic protective layers. This disposable protective approach allows for adequate protection during manufacturing while enabling quick removal to proceed with subsequent production steps, thereby reducing overall production time
3Manufacturing precision
If separate conductive layers are used for wirings and pads, then manufacturing precision is improved, but ease of manufacture deteriorates
Solution Approach 1:
The patent merges wiring and pad formation into a single layer, using one patterning and deposition process to create both features. This eliminates the need for multiple separate conductive layers and their associated processing steps, making manufacturing easier while maintaining precise definition of wiring and pad locations through careful photoresist patterning
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method significantly shortens production time, reduces production costs, and improves growth efficiency by allowing simultaneous formation of wirings and pads and eliminating the need for inorganic protective layer processing.
Implementation Method 1
forming a photoresist material layer on the surface of the conductive seed layer away from the base substrate; and exposing and developing the photoresist material layer to form the removable pattern defining layer
Implementation Method 2
forming an electroplated metal layer on the surface of the conductive seed layer in the first openings by an electroplating process
Data Source
AI summary
A manufacturing method for an array substrate, an array substrate, and a display apparatus. The manufacturing method comprises: step S100, providing a base substrate; step S200, forming a driving circuit layer on one side of the base substrate the driving circuit layer comprising a plurality of wires and a plurality of bonding pads; step S300, forming a removable protective layer on the side of the driving circuit layer away from the base substrate; and step S400, connecting functional devices to the bonding pads, the removable protective layer being decomposed and removed in step S400. Between step S200 and step S300, there are no steps of forming an inorganic protective layer and patterning the inorganic protective layer.