Array Substrate Wiring Structure for Low-Resistance Display Lines

The patent transitions from a single-layer thick conductive structure to a multi-layer stacked conductive structure. The first conductive layer (with data lines) and second conductive layer (with auxiliary lines) are stacked vertically, allowing current to flow through multiple paths and effectively reducing resistance without increasing the thickness of any single layer. This dimensional change from 2D to 3D conductive pathways solves the contradiction between conductivity and manufacturing complexity.

The conductive system is segmented into multiple independent conductive layers. The first conductive layer contains the primary data lines, while the second conductive layer contains auxiliary lines that provide additional current paths. This segmentation allows each layer to be manufactured and controlled independently, reducing the complexity of manufacturing a single ultra-thick layer while achieving the desired conductivity through combined effect.

By stacking conductive layers vertically with insulating layers in between, the patent creates separated current pathways in the vertical dimension. The first and second conductive layers are isolated by an insulating layer, preventing lateral short circuits that would occur in a single thick layer. The current flows through controlled vertical via holes rather than risking uncontrolled lateral leakage paths.

An insulating layer is introduced as an intermediary between the first and second conductive layers. This insulating layer acts as a barrier that prevents direct electrical contact between the stacked conductive layers, eliminating the risk of short circuits between them while still allowing the system to benefit from multiple conductive pathways for reduced resistance.

The conductive system is divided into multiple standard-thickness layers that can be manufactured using conventional thin-film deposition processes. Each layer is formed with standard manufacturing tolerances and thicknesses, avoiding the need for specialized ultra-thin or ultra-thick layer processing equipment. This segmentation into manufacturable units reduces production costs compared to creating a single thick layer.

The multi-layer conductive structure serves multiple functions simultaneously: the first conductive layer provides primary signal transmission, the second conductive layer provides auxiliary current paths and compensation, and the stacked structure enables better heat dissipation and stress distribution. This multi-functionality justifies the additional manufacturing steps by providing multiple benefits beyond just resistance reduction.