Articulated Direct-Mount Inductor for RF Impedance Matching
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Solution Overview
Problem
In semiconductor device fabrication, impedance matching systems experience overheating issues due to radiofrequency power transmission, particularly affecting fasteners within the strong electromagnetic field of conventional inductors, leading to thermal damage and inefficiencies in heat management.
Innovation Solution
The articulated direct-mount inductor is designed with articulation portions and mounting structures made of electrically conductive material, allowing direct connection to electrical components outside the strong electromagnetic field, eliminating the need for fasteners within the field and reducing heat-related issues by optimizing the inductor's configuration and mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional inductors with fasteners are used within the strong electromagnetic field, then electrical connection is achieved, but thermal damage occurs to fasteners due to heating
Solution Approach 1:
The patent removes fasteners from the strong electromagnetic field region by extending mounting structures outward from the coil assembly. The mounting structures position electrical connections at locations where electromagnetic heating is minimal, thereby extracting the fasteners from the harmful thermal environment while maintaining electrical connectivity.
Solution Approach 2:
The patent transitions from a two-dimensional planar coil structure to a three-dimensional configuration by extending mounting structures in spatial dimensions away from the coil plane. This dimensional extension allows mounting regions to be positioned outside the strong electromagnetic field while maintaining electrical connection to the coil.
2Ease of operation
If mounting structures are positioned within the strong electromagnetic field for direct connection, then installation is simplified, but thermal damage occurs
Solution Approach 1:
The patent extracts mounting structures from the harmful electromagnetic field region by extending them outward from the coil assembly. This allows direct mounting and simplified installation while positioning connections in regions where electromagnetic heating is minimal, thereby eliminating thermal damage risks.
Solution Approach 2:
The mounting structures serve as intermediaries that extend from the coil assembly to external electrical components. These intermediaries transmit electrical connections while physically separating the connection points from the strong electromagnetic field region, thereby mediating between the need for direct connection and the need to avoid thermal damage.
3Reliability
If fasteners are used within the electromagnetic field, then electrical connection is secured, but heat management efficiency decreases
Solution Approach 1:
The patent extracts fasteners and mounting structures from the strong electromagnetic field region, positioning them where electromagnetic energy conversion to heat is minimal. This maintains secure electrical connections while eliminating the energy loss to heating that plagues conventional inductor designs.
4Ease of manufacture
If conventional inductor design with separate fasteners is used, then assembly is straightforward, but component count increases
Solution Approach 1:
The patent merges the coil assembly and mounting structures into a single integrated inductor structure. The mounting structures are formed as continuous extensions of the coil windings, eliminating the need for separate fasteners and reducing component count while maintaining assembly straightforwardness.
Solution Approach 2:
The mounting structures serve multiple functions: they provide mechanical support for electrical connections, conduct electrical current from the coil to external components, and position connections outside the electromagnetic field. This multi-functionality eliminates the need for separate fastener components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the operating temperature of the inductor and prevents thermal damage, maintaining efficiency while simplifying the installation process and reducing component count, thus enhancing the reliability and performance of impedance matching systems.
Implementation Method 1
a strong electromagnetic field emanating from the coil portion when radiofrequency power is transmitted through the articulated direct-mount inductor
Implementation Method 2
a coil portion of an electrically conductive material
Data Source
Figure 1A~1B
Figure 1C~1D
Figure 1E~1F
AI summary
A coil portion is formed. A first articulation portion extends from the coil portion. A first mounting structure extends from the first articulation portion. The first mounting structure includes a first mounting region configured to mount in contact with a terminal of a first electrical component. The first articulation portion and the first mounting structure are configured to position the first mounting region at a location outside of a strong electromagnetic field emanating from the coil portion. A second articulation portion extends from the coil portion. A second mounting structure extends from the second articulation portion. The second mounting structure includes a second mounting region configured to mount in contact with a terminal of a second electrical component. The second articulation portion and the second mounting structure are configured to position the second mounting region at a location outside of the strong electromagnetic field emanating from the coil portion.